{"title":"Thermomechanical Modeling of High-Temperature Bonded Interface Materials","authors":"P. Paret, D. DeVoto, S. Narumanchi","doi":"10.1007/978-3-319-99256-3_4","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":184387,"journal":{"name":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","volume":"71 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Die-Attach Materials for High Temperature Applications in Microelectronics Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1007/978-3-319-99256-3_4","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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