Reticular Graphene Reinforced Copper for Electromagnetic Shielding Application

Abstract

The performance and longevity of smart electrical gadgets are heavily dependent on heat dissipation and electromagnetic (EM) shielding capabilities, which must be solved. The reticulated architecture of Graphene foam (GrF) is adopted for developing advanced Cu matrix composites for EM shielding applications. A layered structure of Cu-decorated GrF interface with a thickness of up to 1 μm embedded in the Cu matrix was consolidated by spark plasma sintering (SPS). SPS has also shown the successful and seamless fabrication of graded porosity in Cu matrix with a multi-layered Cu decorated GrF interface. The improved shielding effectiveness (SE) up to the frequency of 250 MHz in Cu-GrF (40–120 dB) when compared to Cu (60 dB) is attributed to the intrinsic conductivity of GrF. The study suggests an effective method to design Gr-based composites with a layered structure suitable for high performance in flexible microwave identification devices.