High Performance Elastic Connection for Reliable Device Testing

K. Hiwada, T. Tamura
{"title":"High Performance Elastic Connection for Reliable Device Testing","authors":"K. Hiwada, T. Tamura","doi":"10.1109/ICMCM.1994.753557","DOIUrl":null,"url":null,"abstract":"We propose the newly developed contact scheme for high performance DUT (Device Under Test) interface, so called, HiPEC (High Performance Elastic Connection). The HiPEC consists of Ni based micro- bumps with Cu line-pattern on P-PTFE (Porous Poly Tetra Fluoro Ethylene) membrane, supported by silicon rubber elastoma. The metal contact via micro-bump makes a reliable contact by scratching action, generated by shape transformation of elastoma under small force. The P-PTFE membrane is usable beyond 10 GHz high frequency signal transmission, and has excellent high isolation characteristics with less than sub-pA leakage current. The HiPEC technology is useful for high pin count DUT interface with high performance, replacing contact-pin, and also for die chip contact to enable KGD (Known- Good Die) test of mixed signals MCM (Multi Chip Module).","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"7 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753557","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

We propose the newly developed contact scheme for high performance DUT (Device Under Test) interface, so called, HiPEC (High Performance Elastic Connection). The HiPEC consists of Ni based micro- bumps with Cu line-pattern on P-PTFE (Porous Poly Tetra Fluoro Ethylene) membrane, supported by silicon rubber elastoma. The metal contact via micro-bump makes a reliable contact by scratching action, generated by shape transformation of elastoma under small force. The P-PTFE membrane is usable beyond 10 GHz high frequency signal transmission, and has excellent high isolation characteristics with less than sub-pA leakage current. The HiPEC technology is useful for high pin count DUT interface with high performance, replacing contact-pin, and also for die chip contact to enable KGD (Known- Good Die) test of mixed signals MCM (Multi Chip Module).
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
用于可靠设备测试的高性能弹性连接
我们提出了新开发的用于高性能DUT(被测设备)接口的接触方案,即HiPEC(高性能弹性连接)。HiPEC由在P-PTFE(多孔聚四氟乙烯)膜上的镍基微凸起组成,由硅橡胶弹性瘤支撑。通过微碰触的金属接触,是利用弹性体在小力作用下的形状转变而产生的刮擦作用,实现可靠的接触。P-PTFE膜可用于10 GHz以上的高频信号传输,具有优异的高隔离特性,泄漏电流小于亚pa。HiPEC技术可用于高性能的高引脚数DUT接口,取代接触引脚,也可用于芯片接触,以实现混合信号MCM(多芯片模块)的KGD(已知-好模)测试。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Volume Implementation of MCM-D Based Cache SRAM Products for Workstation and PC Applications Evaluation of Ionic Salt Photodefinable Polyimides As Mcm-D Dielectrics with Copper Metallization An Application Strategy for Scm-L and Mcm-L Using High Density Laminate Technologies Integrated Flex: Rigid-Flex Capability in a High Performance Mcm Multichip module technologies for high-speed ATM switching systems
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1