Reduced-Order Stochastic Testing of Interconnects Subject to Line Edge Roughness

Martijn Huynen, R. Waeytens, Dries Bosman, M. Gossye, H. Rogier, D. Ginste
{"title":"Reduced-Order Stochastic Testing of Interconnects Subject to Line Edge Roughness","authors":"Martijn Huynen, R. Waeytens, Dries Bosman, M. Gossye, H. Rogier, D. Ginste","doi":"10.1109/SPI57109.2023.10145572","DOIUrl":null,"url":null,"abstract":"In this contribution we study the propagation constant of interconnects subject to line edge roughness by means of an efficient stochastic framework. By employing the stochastic testing method, we succeed in limiting the number of calls to the full-wave electromagnetic field solver at the core of the system. Additionally, the computationally burdensome solution of the eigenvalue problem is eased by reducing its order through projection on an appropriate basis. The resulting two-step accel-eration leads to an effective approach to assess the effect of line edge roughness on the characteristics of interconnects. The novel framework is applied to a rough rectangular waveguide and a microstrip.","PeriodicalId":281134,"journal":{"name":"2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2023-05-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE 27th Workshop on Signal and Power Integrity (SPI)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SPI57109.2023.10145572","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

In this contribution we study the propagation constant of interconnects subject to line edge roughness by means of an efficient stochastic framework. By employing the stochastic testing method, we succeed in limiting the number of calls to the full-wave electromagnetic field solver at the core of the system. Additionally, the computationally burdensome solution of the eigenvalue problem is eased by reducing its order through projection on an appropriate basis. The resulting two-step accel-eration leads to an effective approach to assess the effect of line edge roughness on the characteristics of interconnects. The novel framework is applied to a rough rectangular waveguide and a microstrip.
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受线边缘粗糙度影响的互连的降阶随机测试
在这篇贡献中,我们用一个有效的随机框架研究了受线边缘粗糙度影响的互连的传播常数。通过采用随机测试方法,我们成功地限制了系统核心全波电磁场求解器的调用次数。此外,通过在适当的基础上进行投影来降低特征值问题的阶数,从而减轻了计算量大的问题的求解。由此产生的两步加速度导致了一种有效的方法来评估线边缘粗糙度对互连特性的影响。该框架应用于粗糙矩形波导和微带上。
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