{"title":"Reduction in radiated emission using CSP with built-in decoupling components","authors":"K. Nakano, T. Sudo, S. Haga","doi":"10.1109/EPEP.2003.1250030","DOIUrl":null,"url":null,"abstract":"Reducing radiated emission by using a chip size package with built-in decoupling components is verified experimentally. By adopting built-in decoupling components, based on the current fluctuation by the simple equivalent circuit model, valid reduction in radiated emission is recognized.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250030","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Reducing radiated emission by using a chip size package with built-in decoupling components is verified experimentally. By adopting built-in decoupling components, based on the current fluctuation by the simple equivalent circuit model, valid reduction in radiated emission is recognized.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
