{"title":"Advanced Mcm-L in Apachip a European Cooperative Program","authors":"K. Kurzweil, H. Wessely","doi":"10.1109/ICMCM.1994.753583","DOIUrl":null,"url":null,"abstract":"The European Economic Community is sponsoring technical projects carried out in cooperation by European Companies and academic institutions. APACHIP -Advanced Packaging for High Performance has significantly contributed to the advancement of packaging technology in Europe, covering various aspects of high performance packaging. This paper illustrates one of the specific project tasks aimed at building a complex large size water cooled MCM-L module populated with up to 100 TAB bonded complex semiconductor chips.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"334 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753583","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The European Economic Community is sponsoring technical projects carried out in cooperation by European Companies and academic institutions. APACHIP -Advanced Packaging for High Performance has significantly contributed to the advancement of packaging technology in Europe, covering various aspects of high performance packaging. This paper illustrates one of the specific project tasks aimed at building a complex large size water cooled MCM-L module populated with up to 100 TAB bonded complex semiconductor chips.
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