Parasitics effects in multi gate MOSFETs

Yusuke Kobayashi, C. R. Manoj, K. Tsutsui, Venkanarayan Hariharan, K. Kakushima, V. Rao, P. Ahmet, H. Iwai
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引用次数: 1

Abstract

The parasitics in multi-gate transistors (MugFETs or FinFETs) are expected to significantly degrade the device and circuit performance in scaled technologies. Using extensive 3-D device and circuit simulations, the impact of parasitics on the device and circuit performance is systematically investigated. The results clearly identify the issues in integrating high-K gate dielectrics in scaled multi-gate transistors. We show from 3-D simulations that, when a high-K gate dielectric (with a K ~ 15, similar to hafnium oxide) is integrated in a multi-gate transistor, a 5times increase (compared to the SiO2) in the off current occurs due to the fringing field induced barrier lowering effects. At the circuit level, our results show that, an order of magnitude degradation in the delay can take place, due to the unoptimized FinFET layouts.
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多栅mosfet的寄生效应
多栅极晶体管(mugfet或finfet)中的寄生效应预计将显著降低器件和电路的性能。通过广泛的三维器件和电路仿真,系统地研究了寄生对器件和电路性能的影响。结果清楚地指出了在多栅极晶体管中集成高k栅极电介质的问题。我们从三维模拟中显示,当在多栅极晶体管中集成高K栅极介电介质(K ~ 15,类似于氧化铪)时,由于边缘场诱导的势垒降低效应,关闭电流增加了5倍(与SiO2相比)。在电路层面,我们的结果表明,由于未优化的FinFET布局,延迟可能会发生一个数量级的下降。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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