C. Baudot, M. Douix, S. Guerber, S. Crémer, N. Vulliet, J. Planchot, Romuald Blanc, L. Babaud, C. Alonso‐Ramos, D. Benedikovich, D. Pérez-Galacho, S. Messaoudene, Sébastien Kerdilès, P. Acosta-Alba, C. Euvrard-Colnat, E. Cassan, D. Marris-Morini, L. Vivien, F. Boeuf
{"title":"Developments in 300mm silicon photonics using traditional CMOS fabrication methods and materials","authors":"C. Baudot, M. Douix, S. Guerber, S. Crémer, N. Vulliet, J. Planchot, Romuald Blanc, L. Babaud, C. Alonso‐Ramos, D. Benedikovich, D. Pérez-Galacho, S. Messaoudene, Sébastien Kerdilès, P. Acosta-Alba, C. Euvrard-Colnat, E. Cassan, D. Marris-Morini, L. Vivien, F. Boeuf","doi":"10.1109/IEDM.2017.8268495","DOIUrl":null,"url":null,"abstract":"Silicon photonics technological platforms are meant to generate derivative products and concurrently to benefit from the main advantages associated with CMOS platforms namely: high yield, system robustness, product reliability and large volume, low cost production. Nevertheless, a simultaneous innovative approach is to analogously take advantage from state-of-the-art fabrication methods and tools available in CMOS to develop new solutions and propose better performing devices to the platform.","PeriodicalId":412333,"journal":{"name":"2017 IEEE International Electron Devices Meeting (IEDM)","volume":"53 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"16","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2017.8268495","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 16
Abstract
Silicon photonics technological platforms are meant to generate derivative products and concurrently to benefit from the main advantages associated with CMOS platforms namely: high yield, system robustness, product reliability and large volume, low cost production. Nevertheless, a simultaneous innovative approach is to analogously take advantage from state-of-the-art fabrication methods and tools available in CMOS to develop new solutions and propose better performing devices to the platform.