Accelerating chip design with machine learning: From pre-silicon to post-silicon

Cheng Zhuo, Bei Yu, Di Gao
{"title":"Accelerating chip design with machine learning: From pre-silicon to post-silicon","authors":"Cheng Zhuo, Bei Yu, Di Gao","doi":"10.1109/SOCC.2017.8226046","DOIUrl":null,"url":null,"abstract":"At sub-22nm regime, chip designs have to go through hundreds to thousands of steps and tasks before shipment. Many tasks are data and simulation intensive, thereby demanding significant amount of resources and time. Unlike conventional methodologies relying on experiences to manually handle data and extract models, recent advances in machine learning techniques enable the successful applications in various complex tasks to accelerate modern chip designs, ranging from pre-silicon verification to post-silicon validation and tuning. The goals are to reduce the amount of time and efforts to process and understand data through automatic and effective learning and enhancing from examples. In this paper we review and discuss several application cases of machine learning techniques, including pre-silicon hotspot detection through classification, post-silicon variation extraction and bug localization through inference, and post-silicon timing tuning through iterative learning and optimization, so as to leverage the potentials and inspire more future innovations.","PeriodicalId":366264,"journal":{"name":"2017 30th IEEE International System-on-Chip Conference (SOCC)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 30th IEEE International System-on-Chip Conference (SOCC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOCC.2017.8226046","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7

Abstract

At sub-22nm regime, chip designs have to go through hundreds to thousands of steps and tasks before shipment. Many tasks are data and simulation intensive, thereby demanding significant amount of resources and time. Unlike conventional methodologies relying on experiences to manually handle data and extract models, recent advances in machine learning techniques enable the successful applications in various complex tasks to accelerate modern chip designs, ranging from pre-silicon verification to post-silicon validation and tuning. The goals are to reduce the amount of time and efforts to process and understand data through automatic and effective learning and enhancing from examples. In this paper we review and discuss several application cases of machine learning techniques, including pre-silicon hotspot detection through classification, post-silicon variation extraction and bug localization through inference, and post-silicon timing tuning through iterative learning and optimization, so as to leverage the potentials and inspire more future innovations.
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在22nm以下的工艺中,芯片设计在出货前必须经过数百到数千个步骤和任务。许多任务都是数据和模拟密集型的,因此需要大量的资源和时间。与依靠经验手动处理数据和提取模型的传统方法不同,机器学习技术的最新进展使各种复杂任务的成功应用能够加速现代芯片设计,从硅前验证到硅后验证和调优。目标是通过自动和有效的学习以及从示例中增强来减少处理和理解数据的时间和精力。本文回顾和讨论了机器学习技术的几个应用案例,包括通过分类进行pre-silicon热点检测,通过推理进行post-silicon变异提取和bug定位,以及通过迭代学习和优化进行post-silicon定时调优,从而发挥潜力,激发更多未来的创新。
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