Simulation-based design of high dimensional electromagnetic systems

W. Cui, A. Sathanur, V. Jandhyala
{"title":"Simulation-based design of high dimensional electromagnetic systems","authors":"W. Cui, A. Sathanur, V. Jandhyala","doi":"10.1109/EPEPS.2012.6457876","DOIUrl":null,"url":null,"abstract":"Full-wave simulation and design of interconnect systems is becoming increasingly important in view of the continuing trend towards miniaturization and dense integration of components in electronic systems. While full-wave simulation methods have advanced rapidly over the last decade, there is a growing need for superior automated design tools. In this paper we first motivate the need for better design space exploration in high dimensions and outline the key ingredients that are imperative for the development of a successful simulation-based automated design tool. In this direction we describe the application of Orthogonal Arrays as an efficient sampling scheme and the Gaussian Process Regression as a promising model generation scheme for high dimensional design space exploration. We also describe an adaptive strategy for the model refinement and illustrate the same with a full-wave multi-conductor transmission line example. Finally we conclude by outlining the open problems and research challenges in this direction.","PeriodicalId":188377,"journal":{"name":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","volume":"81 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE 21st Conference on Electrical Performance of Electronic Packaging and Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEPS.2012.6457876","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Full-wave simulation and design of interconnect systems is becoming increasingly important in view of the continuing trend towards miniaturization and dense integration of components in electronic systems. While full-wave simulation methods have advanced rapidly over the last decade, there is a growing need for superior automated design tools. In this paper we first motivate the need for better design space exploration in high dimensions and outline the key ingredients that are imperative for the development of a successful simulation-based automated design tool. In this direction we describe the application of Orthogonal Arrays as an efficient sampling scheme and the Gaussian Process Regression as a promising model generation scheme for high dimensional design space exploration. We also describe an adaptive strategy for the model refinement and illustrate the same with a full-wave multi-conductor transmission line example. Finally we conclude by outlining the open problems and research challenges in this direction.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
高维电磁系统的仿真设计
鉴于电子系统中元件不断趋向小型化和密集集成化,互连系统的全波仿真与设计变得越来越重要。虽然全波仿真方法在过去十年中发展迅速,但对高级自动化设计工具的需求日益增长。在本文中,我们首先激发了在高维空间中进行更好的设计探索的需求,并概述了开发成功的基于仿真的自动化设计工具所必需的关键要素。在这个方向上,我们描述了正交阵列作为一种有效的抽样方案和高斯过程回归作为一种有前途的高维设计空间探索模型生成方案的应用。我们还描述了一种模型改进的自适应策略,并以全波多导体传输线为例进行了说明。最后,我们概述了该方向的开放性问题和研究挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Nonlinear block-type leapfrog scheme for the fast simulation of multiconductor transmission lines with nonlinear drivers and terminations S-parameter based multimode signaling Simultaneous switching noise analysis of reference voltage rails for pseudo differential interfaces A partial homomorphic encryption scheme for secure design automation on public clouds Thermal characterization of TSV based 3D stacked ICs
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1