Multilevel Ge-Se Film Based Resist Systems

Abstract

Multilevel resist systems based on Ge-Se films make possible the use of optical projection printers for printing 0.5-1.0μm features. The four multilevel resist systems considered employ either a photosensitive or a photopassive polymer layer for planarization. In bilevel schemes the surface of the Ge-Se film is reacted in a Ag(CN)i- containing solution to form a Ag2Se imaging layer. No reacted Ge-Se is used as a sacrificial layer in trilevel schemes. Ge-Se films are resistant to attack by oxygen plasma and therefore make good masks for pattern transfer by dry (reactive ion) etching, to a thick underlying photopassive polymer layer. Because of their high absorbance (a 105cm-1) in the ultraviolet and violet, Ge-Se patterns can also be used as exposure masks for transferring images to a thick underlying photosensitive polymer layer. The latter is "flood" exposed through the Ge-Se mask and wet developed. Both dry and wet processes provide steep wall-profile patterns in the polymer layer. The dry process provides superior feature size control while the wet process offers reduced processing cost. The exceptional lithographic performance exhibited by Ge-Se resist systems is attributed to a unique edge-sharpening effect; diffraction is compensated for by lateral silver diffusion in the Ag2Se layer. Patterns having 0.6μm lines and spaces are obtained over lcmXlcm fields with a defocus tolerance of 2.5μm using a standard Zeiss 10:1 reduction lens (N.A.=0.28, λ=436nm). Results indicate that optical lithography can practically print features in the size regime previously reserved for a-beam or x-ray based lithographic technologies.