L. Licciardi, M. Peretti, L. Pilati, J.J. Ichai, F. Martin, Y. Urena
{"title":"A multichip module solution for high performance ATM switching","authors":"L. Licciardi, M. Peretti, L. Pilati, J.J. Ichai, F. Martin, Y. Urena","doi":"10.1109/MCMC.1996.510761","DOIUrl":null,"url":null,"abstract":"the high industrial importance that ATM (asynchronous transfer mode) is assuming in the telecommunication environment strongly drives technology improvements. A MCM-C 16/spl times/16 Switching Element (MCM-BASE16) for the industrial ATM cross connect UTXC is presented; implementation details are described regarding both the substate characteristics and the new IBM CCGA (ceramic column grid array) packaging technique. Electrical and thermal analysis results are reported and finally the testing methodology is presented both at the substrate and at the module level. The MCM-BASEI6 has a global throughput of 5 Gbit/s, works at 77.8 MHz and dissipates approximately 10 W at the operating frequency; these results confirm the effectiveness of this new packaging technique in obtaining high speed and area performance.","PeriodicalId":126969,"journal":{"name":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","volume":"32 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-02-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"10","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings 1996 IEEE Multi-Chip Module Conference (Cat. No.96CH35893)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MCMC.1996.510761","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 10
Abstract
the high industrial importance that ATM (asynchronous transfer mode) is assuming in the telecommunication environment strongly drives technology improvements. A MCM-C 16/spl times/16 Switching Element (MCM-BASE16) for the industrial ATM cross connect UTXC is presented; implementation details are described regarding both the substate characteristics and the new IBM CCGA (ceramic column grid array) packaging technique. Electrical and thermal analysis results are reported and finally the testing methodology is presented both at the substrate and at the module level. The MCM-BASEI6 has a global throughput of 5 Gbit/s, works at 77.8 MHz and dissipates approximately 10 W at the operating frequency; these results confirm the effectiveness of this new packaging technique in obtaining high speed and area performance.
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