High-density and high-performance 6T-SRAM for system-on-chip in 130 nm CMOS technology

W. Kong, R. Venkatraman, R. Castagnetti, F. Duan, S. Ramesh
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引用次数: 12

Abstract

We have developed the smallest high density 6T-SRAM cell (1.87 /spl mu/m/sup 2/) reported to date in 130 nm CMOS logic process for system-on-chip (SOC) applications. We have also developed an ultra-high speed 6T-SRAM cell (2.49 /spl mu/m/sup 2/) with cell current of 116 /spl mu/A for SOC applications requiring even higher performance. These were achieved using our systematic SRAM technology development methodology and optimized OPC capability. These cells do not require additional process steps and use 248 nm lithography, making them very attractive for low-cost SOC manufacturing.
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高密度、高性能的6T-SRAM,采用130纳米CMOS技术
我们已经开发出最小的高密度6T-SRAM单元(1.87 /spl mu/m/sup 2/),迄今为止报道的130纳米CMOS逻辑工艺用于片上系统(SOC)应用。我们还开发了超高速6T-SRAM单元(2.49 /spl mu/m/sup 2/),单元电流为116 /spl mu/A,适用于需要更高性能的SOC应用。这些都是通过我们系统的SRAM技术开发方法和优化的OPC能力实现的。这些电池不需要额外的工艺步骤,并且使用248纳米光刻技术,这使得它们对于低成本的SOC制造非常有吸引力。
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