W.M. Huang, Y. Tseng, D. Monk, D. Diaz, J. Ford, S. Cheng
{"title":"TFSOI technology for portable wireless communication systems","authors":"W.M. Huang, Y. Tseng, D. Monk, D. Diaz, J. Ford, S. Cheng","doi":"10.1109/CICC.1997.606658","DOIUrl":null,"url":null,"abstract":"Recent growth in the portable wireless communication market has driven semiconductor technologies toward voltage and power reduction. The reduced junction capacitance and near-ideal MOS device characteristics of SOI provides an inherent advantage for low-voltage low-power applications. Substantial progress in applying SOI technology for these applications has been demonstrated in recent years. The quest for a single chip system has also initiated work in developing high frequency and analog SOI circuits. In this paper, the application of Thin-Film-Silicon-On-Insulator (TFSOI) technology for wireless communication systems is reviewed and future development discussed.","PeriodicalId":111737,"journal":{"name":"Proceedings of CICC 97 - Custom Integrated Circuits Conference","volume":"12 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1997-05-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of CICC 97 - Custom Integrated Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICC.1997.606658","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 9
Abstract
Recent growth in the portable wireless communication market has driven semiconductor technologies toward voltage and power reduction. The reduced junction capacitance and near-ideal MOS device characteristics of SOI provides an inherent advantage for low-voltage low-power applications. Substantial progress in applying SOI technology for these applications has been demonstrated in recent years. The quest for a single chip system has also initiated work in developing high frequency and analog SOI circuits. In this paper, the application of Thin-Film-Silicon-On-Insulator (TFSOI) technology for wireless communication systems is reviewed and future development discussed.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
