An extension of input sample acceptance for SELA MC600 micro-cleaving tool

Abstract

Minimum input sample size and thickness for SELA MC600, a micro-cleaving tool, is 9 × 6 mm and 0.6 mm respectively. The machine will reject sample which is smaller or thinner than this acceptance value. But, in semiconductor Failure Analysis (FA) laboratories, it is inevitable to face such small and thin sample, for instance, a die from backgrinded wafer. Therefore, a technique named Dual-Edged Cleaving (DEC) is invented to circumvent this restriction.