A method for FinFET intermodulation analysis from TCAD simulations using a time-domain waveform approach

F. Ahmad, M. S. Alam, G. A. Armstrong
{"title":"A method for FinFET intermodulation analysis from TCAD simulations using a time-domain waveform approach","authors":"F. Ahmad, M. S. Alam, G. A. Armstrong","doi":"10.1109/MSPCT.2009.5164229","DOIUrl":null,"url":null,"abstract":"FinFETs are very promising for integrated circuit low signal anolog applications. In this paper we present, non-linear analysis of this type of devices using technology CAD (TCAD), which complements the already done studies about the advantages and possibilities of source/drain extension (SDE) engineering of FinFET for anolog applications. This is a simple and fast way to predict linearity using TCAD at an early stage FinFET design process. The method is based on time domain waveforms at drain and gate terminals at different input power level. By carrying out spectrum analysis of time-domain signals and knowing fundamental power P<inf>fund</inf> and third order harmonics ( IM<sup>3</sup> ) power at different input power have been used to determine third-order intercept ( IP<inf>3</inf> ). The value of IP<inf>3</inf> obtained using approach is found to ∼4dBm at V<inf>g</inf> = 0.25V and V<inf>d</inf> = 1.1V . Further on V<inf>g</inf> is varied at fixed V<inf>d</inf> = 1.1V , and effect of V<inf>g</inf> on 3 fund IM<inf>3</inf> / P<inf>fund</inf> is investigated.","PeriodicalId":179541,"journal":{"name":"2009 International Multimedia, Signal Processing and Communication Technologies","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2009-03-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 International Multimedia, Signal Processing and Communication Technologies","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MSPCT.2009.5164229","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

FinFETs are very promising for integrated circuit low signal anolog applications. In this paper we present, non-linear analysis of this type of devices using technology CAD (TCAD), which complements the already done studies about the advantages and possibilities of source/drain extension (SDE) engineering of FinFET for anolog applications. This is a simple and fast way to predict linearity using TCAD at an early stage FinFET design process. The method is based on time domain waveforms at drain and gate terminals at different input power level. By carrying out spectrum analysis of time-domain signals and knowing fundamental power Pfund and third order harmonics ( IM3 ) power at different input power have been used to determine third-order intercept ( IP3 ). The value of IP3 obtained using approach is found to ∼4dBm at Vg = 0.25V and Vd = 1.1V . Further on Vg is varied at fixed Vd = 1.1V , and effect of Vg on 3 fund IM3 / Pfund is investigated.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
用时域波形法分析TCAD仿真中FinFET互调的方法
finfet在集成电路低信号模拟应用中非常有前途。在本文中,我们使用CAD (TCAD)技术对这种类型的器件进行非线性分析,这补充了已经完成的关于模拟应用的FinFET源/漏极扩展(SDE)工程的优势和可能性的研究。这是在FinFET设计过程的早期阶段使用TCAD预测线性度的一种简单而快速的方法。该方法基于不同输入功率下漏极端和栅极端的时域波形。通过对时域信号进行频谱分析,了解不同输入功率下的基频功率Pfund和三阶谐波功率,确定三阶截距IP3。在Vg = 0.25V和Vd = 1.1V时,该方法获得的IP3值为~ 4dBm。在固定Vd = 1.1V时,进一步研究了Vg对3基IM3 / Pfund的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
An overview of advanced FPGA architectures for optimized hardware realization of computation intensive algorithms Error resilient technique for SPIHT coded color images Analysis of carbon nanotube interconnects and their comparison with Cu interconnects High input impedance SIMO versatile biquad filter Seismic signal enhancement through statistical (Wiener) approach
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1