Templates for highly ordered SiGe-QD arrays for single photon detection

J. Moers, N. P. Stcpina, S. Trellenkamp, D. Grutzmacher
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Abstract

Two and three dimensional SiGe-QD-arrays can be regarded as a test-system for artificial crystals, as they also can be utilized as single photon detectors. While arrays with randomly distributed SiGe-QD can easily be grown on plain silicon surfaces, the fabrication of ordered arrays with pitches done to a few 10 nm is challenging: to facilitate Template Assisted Self Assembled growth of SiGe-QD in MBE, ordered arrays of seed holes have to be etched into the silicon substrate. EUV-interference lithography can be employed, but here no spatial relation to previous or later process steps is possible. In this work contrast and resolution of ZEP 520A-7 is investigated in terms of development temperature, duration and acceleration voltage during e-beam exposure to obtain laterally ordered well localized SiGe-QD-arrays. By increasing acceleration voltage from 50 kV to 100 kV contrast can be improved by a factor of 1.9, shifting the resolution from 40 nm pitch seed hole arrays etched in silicon to 30 nm.
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用于单光子检测的高有序SiGe-QD阵列模板
二维和三维sige - qd阵列可以被视为人工晶体的测试系统,因为它们也可以用作单光子探测器。虽然具有随机分布的SiGe-QD阵列可以很容易地在平坦的硅表面上生长,但具有10nm间距的有序阵列的制造是具有挑战性的:为了促进模板辅助自组装SiGe-QD在MBE中的生长,必须在硅衬底上蚀刻有序的种子孔阵列。可以使用euv干涉光刻,但这里不可能与之前或之后的工艺步骤有空间关系。在这项工作中,研究了ZEP 520A-7在电子束暴露期间的发展温度,持续时间和加速电压的对比度和分辨率,以获得横向有序的良好定位的sige - qd阵列。通过将加速电压从50 kV增加到100 kV,对比度可以提高1.9倍,将硅蚀刻的40 nm间距种子孔阵列的分辨率提高到30 nm。
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