A novel surface passivation process for HfO/sub 2/ Ge MOSFETs

N. Wu, Qingchun Zhang, Chunxiang Zhu, D. Chan, M. Li, N. Balasubramanian, A. Du, A. Chin, J. Sin, D. Kwong
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Abstract

This work presents a novel surface passivation process for HfO/sub 2/ Ge MOSFETs which we have developed, using in-situ SiH/sub 4/ treatment prior to HfO/sub 2/ deposition. Results show that, compared to conventional surface nitridation, TaN/HfO/sub 2//Ge pMOSFETs with in-situ SiH/sub 4/ surface treatment have much reduced frequency dispersion and hysteresis, improved gate leakage distribution, better subthreshold swing and higher hole mobility.
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HfO/sub 2/ Ge mosfet表面钝化新工艺
本工作提出了一种新的HfO/sub 2/ Ge mosfet表面钝化工艺,该工艺在HfO/sub 2/沉积之前使用原位SiH/sub 4/处理。结果表明,与传统表面氮化相比,原位SiH/sub - 4/表面处理的TaN/HfO/sub - 2//Ge pmosfet具有显著降低频散和迟滞的特性,改善栅极泄漏分布,改善亚阈值振荡,提高空穴迁移率。
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