Air-filled substrate integrated waveguide — A flexible and low loss technological platform

Abstract

In this paper, the air-filled substrate integrated waveguide (AFSIW), offering a technological platform for the design of high performance millimeterwave self-packaged substrate integrated components and systems, is presented. AFSIW is based on low-cost printed circuit board (PCB). Several components, including antennas, filters and couplers, have been theoretically studied and experimentally demonstrated up to 60 GHz. This technology, surpassing its dielectric-filled SIW (DFSIW) counterpart, is expected by the authors to replace the rectangular waveguide technology for future low-cost extremely high data rate communication systems and highly sensitive sensors operating at millimeterwave and beyond.