Voltage scaling and temperature effects on drain leakage current degradation in a hot carrier stressed n-MOSFET

Tahui Wang, C. Hsu, L. Chiang, N. Zous, T. Chao, C. Chang
{"title":"Voltage scaling and temperature effects on drain leakage current degradation in a hot carrier stressed n-MOSFET","authors":"Tahui Wang, C. Hsu, L. Chiang, N. Zous, T. Chao, C. Chang","doi":"10.1109/RELPHY.1998.670552","DOIUrl":null,"url":null,"abstract":"Drain leakage current degradation at zero V/sub gs/ in a hot carrier stressed n-MOSFET is measured and modeled. The dependences of drain leakage current on supply voltage and temperature are characterized. In modeling, various drain leakage current mechanisms including drain-to-source subthreshold leakage current, band-to-band tunneling current and interface trap assisted leakage current are taken into account. The results show that interface trap induced leakage current appears to be a dominant drain leakage mechanism as the supply voltage is scaled below 3.0 V. Drain leakage current degradation by orders of magnitude has been observed due to hot carrier stress.","PeriodicalId":196556,"journal":{"name":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","volume":"1999 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1998.670552","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Drain leakage current degradation at zero V/sub gs/ in a hot carrier stressed n-MOSFET is measured and modeled. The dependences of drain leakage current on supply voltage and temperature are characterized. In modeling, various drain leakage current mechanisms including drain-to-source subthreshold leakage current, band-to-band tunneling current and interface trap assisted leakage current are taken into account. The results show that interface trap induced leakage current appears to be a dominant drain leakage mechanism as the supply voltage is scaled below 3.0 V. Drain leakage current degradation by orders of magnitude has been observed due to hot carrier stress.
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热载流子应力n-MOSFET中电压缩放和温度对漏极漏电流衰减的影响
对热载流子应力n-MOSFET在零V/sub /下的漏极漏电流退化进行了测量和建模。研究了漏极漏电流随电源电压和温度的变化规律。在建模中,考虑了漏极漏源亚阈值漏电流、带到带隧道电流和界面陷阱辅助漏电流等漏极漏电流机制。结果表明,当电源电压低于3.0 V时,界面阱诱导漏电流是漏极泄漏的主要机制。由于热载流子应力的作用,漏极漏电流下降了几个数量级。
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