Undoped SiGe material calibration for numerical nanosecond laser annealing simulations

A. Royet, L. Dagault, S. Kerdilès, P. Alba, J. P. Barnes, Filadelfo Cristiano, Karim Huet
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Abstract

Physical parameters calibration (dielectric and alloy properties) of Si$_{1-X}$Gex alloys is presented in order to simulate the Ultra Violet-Nanosecond Laser Annealing (UV-NLA) of this material for Si/ Si$_{1-X}$Gex based MOS devices. Optical and physical parameters are extracted and modeled from experimental characterizations for several Ge concentrations and then fitted to match experimental laser annealing results. A good prediction, in terms of melt depth and melting duration, is achieved for different Ge concentrations between 20 and 40%, usually encountered in Si$_{1-X}$Gex CMOS integration process.
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数值纳秒激光退火模拟的未掺杂SiGe材料标定
为了模拟Si/ Si$ {1-X}$Gex基MOS器件的紫外-纳秒激光退火(UV-NLA),提出了Si$ {1-X}$Gex合金的物理参数校准(介电性能和合金性能)。从实验表征中提取了几种锗浓度的光学和物理参数并建立了模型,然后进行拟合以匹配实验激光退火结果。在Si$ {1-X}$Gex CMOS集成工艺中,通常会遇到不同浓度的Ge,在20 ~ 40%之间,可以很好地预测熔体深度和熔体持续时间。
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