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2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)最新文献

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Theoretical study of electronic transport in monolayer SnSe 单层SnSe中电子输运的理论研究
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241611
Sanjay Gopalan, G. Gaddemane, M. L. Van de Put, M. Fischetti
Monolayer SnSe is a two-dimensional (2D) material with an indirect band gap ($sim$ 0.92 eV) that can be obtained relatively easily by exfoliating bulk SnSe crystals. Like most 2D van der Waals monolayers, its layered nature reduces or eliminates the defects found in bulk materials, such as surface interface roughness and dangling bonds. Here, we show promising results of first-principle calculations of the low-field mobility and high-field characteristics of monolayer SnSe by implementing the fullband Monte Carlo approach.
单层SnSe是一种二维(2D)材料,具有间接带隙($sim$ 0.92 eV),可以通过剥离大块SnSe晶体相对容易地获得。像大多数二维范德华单层材料一样,它的分层性质减少或消除了块状材料中的缺陷,如表面界面粗糙度和悬垂键。在这里,我们展示了通过实现全波段蒙特卡罗方法计算单层SnSe的低场迁移率和高场特性的第一性原理的有希望的结果。
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引用次数: 0
5 Model analysis for effects of spatial and energy profiles of plasma process-induced defects in Si substrate on MOS device performance 5 .硅衬底等离子体工艺缺陷的空间和能量分布对MOS器件性能影响的模型分析
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241621
T. Hamano, K. Urabe, K. Eriguchi
This paper comprehensively discusses impacts of defect profiles in a Si substrate induced by plasma processing on MOS device performance. Both spatial and energy profiles of the defects considering practical plasma parameters were implemented into a conventional device simulation. Unique capacitance-voltage characteristics of MOS capacitors were obtained depending on the energy profiles, which shows good agreement with experimental results. The relationship between the defect profile and device parameter variation was clarified for n- and p-channel MOSFETs. The prediction results suggest the significance of precise control of spatial and energy profiles of defects for future MOS device design and fabrication.
本文全面讨论了等离子体处理引起的硅衬底缺陷轮廓对MOS器件性能的影响。考虑实际等离子体参数,将缺陷的空间和能量分布实现到常规器件模拟中。根据能量分布得到了MOS电容器独特的电容电压特性,与实验结果吻合较好。阐明了n沟道和p沟道mosfet缺陷分布与器件参数变化的关系。预测结果表明,精确控制缺陷的空间和能量分布对未来MOS器件的设计和制造具有重要意义。
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引用次数: 0
Modeling and Simulation of Si IGBTs Si igbt的建模与仿真
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241627
N. Shigyo, M. Watanabe, K. Kakushima, T. Hoshii, K. Furukawa, A. Nakajima, K. Satoh, T. Matsudai, T. Saraya, T. Takakura, K. Itou, M. Fukui, S. Suzuki, K. Takeuchi, I. Muneta, H. Wakabayashi, S. Nishizawa, K. Tsutsui, T. Hiramoto, H. Ohashi, H. Iwai
Technology CAD (TCAD) has been recognized as a powerful design tool for Si insulated gate bipolar transistors (IGBTs). Here, physical models, such as a mobility model for carrier-carrier scattering, were investigated for a predictive TCAD. Simulated currentvoltage characteristics of the trench-gate IGBTs were compared with measurements. The difference between 3D- and 2D-TCAD simulations was observed in a high current region, which was explained by a bias-dependent current flow. A test element group (TEG) for separation of the emitter currents for holes and electrons was also determined as effective for calibration of lifetime model parameters.
技术CAD (TCAD)已被公认为是硅绝缘栅双极晶体管(igbt)的强大设计工具。在这里,研究了物理模型,如载流子-载流子散射的迁移率模型,以预测TCAD。对沟槽栅igbt的模拟电流电压特性与实测结果进行了比较。3D和2D-TCAD模拟之间的差异是在高电流区域观察到的,这可以用偏置相关的电流来解释。还确定了用于分离空穴和电子的发射极电流的测试元件组(TEG)可有效地校准寿命模型参数。
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引用次数: 2
Numerical Solution of the Constrained Wigner Equation 约束Wigner方程的数值解
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241624
R. Kosik, J. Cervenka, H. Kosina
Quantum electron transport in modern semiconductor devices can be described by a Wigner equation which is formally similar to the classical Liouville equation. The stationary Wigner equation has a singularity at zero momentum (k=0). In order to get a non-singular solution it is necessary to impose a constraint for the solution at k=0 which gives the constrained Wigner equation. We introduce a Petrov-Galerkin method for the solution of the corresponding constrained sigma equation. The constraint in the Wigner equation is interpreted as an extra test function and is naturally incorporated in the method.
现代半导体器件中的量子电子输运可以用维格纳方程来描述,该方程在形式上类似于经典的刘维尔方程。平稳维格纳方程在零动量处有一个奇点(k=0)。为了得到非奇异解,必须对k=0处的解施加约束,从而得到约束Wigner方程。引入了求解相应约束方程的Petrov-Galerkin方法。Wigner方程中的约束被解释为一个额外的测试函数,并自然地纳入该方法。
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引用次数: 1
Nanoscale FET: How To Make Atomistic Simulation Versatile, Predictive, and Fast at 5nm Node and Below 纳米级场效应管:如何在5nm及以下节点上实现通用、预测和快速的原子模拟
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241651
P. Blaise, Udita Kapoor, Mark A. Townsend, E. Guichard, J. Charles, D. Lemus, T. Kubis
Ultra-scaled FET technology requires simulations at the atomic scale. We present the Victory Atomistic tool inherited from Nemo5. Thanks to a combination of non-equilibrium Green’s functions and state-of-the-art band structure calculations, versatile, predictive, and fast simulations become accessible within the self-consistent Born approximation, optimized by a generalized low-rank projection.
超尺度场效应管技术需要在原子尺度上进行模拟。我们介绍了从Nemo5继承的胜利原子工具。由于结合了非平衡格林函数和最先进的带结构计算,在自洽玻恩近似中可以实现通用的、预测性的和快速的模拟,并通过广义低秩投影进行优化。
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引用次数: 1
Gummel-cycle Algebraic Multigrid Preconditioning for Large-scale Device Simulations 大规模器件模拟的gummel循环代数多网格预处理
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241643
Hiroo Koshimoto, H. Ishimabushi, Jaehyun Yoo, Yasuyuki Kayama, Satoru Yamada, U. Kwon, D. Kim
It has been proven that the multigrid method is promissing on large-scale scientific simulations. However there still remains some difficulties on applying the multigrid method, which is the system of systems such as FEM on stress analysis or coupled PDEs. Above all, the drift-diffusion model widely used in the device modeling is a typical case belonging to the problems. Because the model has a tight coupling between the electrostatic field and the carrier movements and this property prevents the multigrid method from working effectively. In this paper, we propose a technique to apply the multigrid method to the drift-diffusion model. The technique consists of reflection process between systems coupled in the equation. Consequently the technique helps to solve large-scale device simulations. We show the case of power devices.
实践证明,多重网格方法在大规模科学模拟中具有广阔的应用前景。然而,将有限元法或耦合偏微分方程等多网格法应用于应力分析仍存在一些困难。其中,广泛应用于器件建模的漂移扩散模型就是这类问题的典型案例。由于模型中静电场与载流子运动之间的紧密耦合,使得多重网格法无法有效地工作。本文提出了一种将多重网格法应用于漂移扩散模型的方法。该技术包括耦合在方程中的系统间的反射过程。因此,该技术有助于解决大规模器件模拟问题。我们展示了动力装置的情况。
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引用次数: 2
Machine Learning Prediction of Defect Formation Energies in a-SiO2 a-SiO2中缺陷形成能的机器学习预测
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241609
D. Milardovich, M. Jech, Dominic Waldhoer, M. Waltl, T. Grasser
Due to its stochastic nature, the calculation of defect formation energies in amorphous structures is a CPU-intensive task. We demonstrate the use of machine learning to predict defect formation energies to significantly minimize the number of required calculations. Different combinations of descriptors and machine learning algorithms are used to predict the formation energies of hydroxyl E’ center defects in amorphous silicon dioxide structures. The performance of each combination is analyzed and compared to results obtained from direct ab initio calculations.
由于其随机性,非晶结构中缺陷形成能的计算是一项cpu密集型的任务。我们演示了使用机器学习来预测缺陷形成能量,以显着减少所需的计算次数。利用描述符和机器学习算法的不同组合来预测非晶二氧化硅结构中羟基E中心缺陷的形成能。对每种组合的性能进行了分析,并与直接从头算得到的结果进行了比较。
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引用次数: 0
Numerical study of surface chemical reactions in 2D-FET based pH sensors 基于二维场效应晶体管的pH传感器表面化学反应的数值研究
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241667
A. Toral-Lopez, E. G. Marín, J. Cuesta, F. Ruiz, F. Pasadas, A. Medina-Rull, A. Godoy
This work numerically evaluates the impact of surface chemical reactions on the performance of 2D-FET based pH sensors. More precisely, we focus on the adsorption of chlorine ions and the expulsion of protons at the sensing interface of FET sensors. This analysis is performed through numerical simulations encompassing the modelling of both the semiconductor device and the liquid solution to be analysed. In the semiconductor region the 2D Poisson - 1D Continuity equations are self-consistently solved, while in the electrolyte region we deal with the modified Poisson - Boltzmann system [1]. The simulator also includes the interactions taking place at the electrolyte-sensing layer interface through: i) the non-constant profile of water permittivity, and ii) the steric effects in the surface ions concentration by means of the Potentials of Mean Force (PMFs) [2], [3]. This comprehensive description of the electrolyte-device interface provides a suitable framework to unveil the relevance of multiple chemical reactions, such as the adsorption of chlorine ions, on the behaviour of 2D-FET based pH sensors.
这项工作数值评估了表面化学反应对基于2D-FET的pH传感器性能的影响。更准确地说,我们关注的是FET传感器传感界面上氯离子的吸附和质子的排出。这种分析是通过数值模拟来进行的,包括对半导体器件和待分析的液体溶液的建模。在半导体区域,二维泊松-一维连续性方程是自洽求解的,而在电解质区域,我们处理的是修正泊松-玻尔兹曼系统[1]。该模拟器还包括发生在电解质传感层界面上的相互作用:i)水介电常数的非恒定分布,以及ii)通过平均力势(PMFs)在表面离子浓度中的空间效应[2],[3]。这种对电解质-器件界面的全面描述为揭示多种化学反应的相关性提供了一个合适的框架,例如氯离子的吸附,以及基于2D-FET的pH传感器的行为。
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引用次数: 0
Complementary FET Device and Circuit Level Evaluation Using Fin-Based and Sheet-Based Configurations Targeting 3nm Node and Beyond 针对3nm及以上节点的基于鳍片和基于薄片的互补FET器件和电路级评估
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241655
Liu Jiang, A. Pal, E. Bazizi, Mehdi Saremi, He Ren, B. Alexander, Buvna Ayyagari-Sangamalli
Complementary FET (CFET), implemented by stacking NMOS and PMOS on top of each other, is considered as an emerging option to continue logic scaling beyond 3nm node. It can be configured with a fin-on-fin (fin-based CFET) or sheet-on-sheet (sheet-based CFET) structures. In this paper, we use 3D-TCAD simulation to compare those two configurations at both device and circuit levels. For accurate comparison between these two CFET configurations, we deploy a drift-diffusion simulation framework, calibrated to semi-classical sub-band BTE (Boltzmann Transport Equation). We show that for the same effective channel width, nMOS of sheet-based CFET has 10% higher drive-current compared to fin-based CFET. For pMOS, sheet-based CFET shows 5% lower drive-current compared to fin-based CFET. When compared for the same device footprint with increased nanosheet width, nMOS and pMOS sheet-based CFET shows 73% and 47% higher drive current respectively compared to fin-based CFET. Using 31-stage ring-oscillator as a representative circuit, we show that for the same electrical channel width, the circuit performance of the sheet-based CFET is 2.6% higher than the fin-based CFET at Vdd of 0.7V. When compared for the same device footprint, sheet-based CFET shows 9% higher circuit performance compared to the fin-based CFET.
互补FET (CFET)是一种将NMOS和PMOS堆叠在一起实现的技术,被认为是一种新兴的逻辑扩展方案,可以继续扩展到3nm节点以上。它可以配置鳍对鳍(基于鳍的CFET)或片对片(基于片的CFET)结构。在本文中,我们使用3D-TCAD仿真在器件和电路级别比较这两种配置。为了准确比较这两种CFET配置,我们部署了一个漂移扩散模拟框架,校准到半经典子带BTE(玻尔兹曼输运方程)。研究表明,在相同的有效沟道宽度下,片基CFET的nMOS驱动电流比鳍形CFET高10%。对于pMOS,基于薄片的CFET显示比基于鳍片的CFET低5%的驱动电流。在增加纳米片宽度的情况下,基于nMOS和pMOS片的cfeet的驱动电流分别比基于鳍片的cfeet高73%和47%。以31级环形振荡器为代表电路,我们发现在相同的电通道宽度下,在Vdd为0.7V时,基于薄片的CFET电路性能比基于鳍片的CFET电路性能高2.6%。当比较相同的器件面积时,基于薄片的CFET的电路性能比基于鳍片的CFET高9%。
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引用次数: 6
Quantum Transport Simulations of Phosphorene Nanoribbon MOSFETs: Effects of Metal Contacts, Ballisticity and Series Resistance 磷烯纳米带mosfet的量子输运模拟:金属接触、弹道性和串联电阻的影响
Pub Date : 2020-09-23 DOI: 10.23919/SISPAD49475.2020.9241601
M. Poljak, M. Matić
Performance of phosphorene nanoribbon (PNR) MOSFETs at “3 nm” logic technology node is studied using atomistic quantum transport simulations, with an emphasis on the impact of metal contacts, series resistance and transport ballisticity. We find that realistic metal contacts decrease drain current by up to 70%, which corresponds to more than $1400 Omega mu mathrm{m}$ in contact resistance (RSD). On the other hand, setting RSD to $270 Omega mumathrm{m}$, as foreseen by the International Roadmap for Devices and Systems (IRDS), PNR MOSFETs would need to operate at 50% to 70% of their ballistic limit, depending on PNR width, in order to meet IRDS targets.
利用原子量子输运模拟研究了磷烯纳米带mosfet在“3nm”逻辑技术节点上的性能,重点研究了金属触点、串联电阻和输运弹道的影响。我们发现,实际的金属触点可减少漏极电流达70%, which corresponds to more than $1400 Omega mu mathrm{m}$ in contact resistance (RSD). On the other hand, setting RSD to $270 Omega mumathrm{m}$, as foreseen by the International Roadmap for Devices and Systems (IRDS), PNR MOSFETs would need to operate at 50% to 70% of their ballistic limit, depending on PNR width, in order to meet IRDS targets.
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引用次数: 3
期刊
2020 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD)
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