Study on Thickness Effect of Three-Point-Bend Specimen

M. Kikuchi, Takehito Ishihara
{"title":"Study on Thickness Effect of Three-Point-Bend Specimen","authors":"M. Kikuchi, Takehito Ishihara","doi":"10.1299/JSMEA.49.411","DOIUrl":null,"url":null,"abstract":"The thickness effect of a three-point-bend (3PB) specimen on dimple fracture behavior is studied experimentally and numerically. At first, fracture toughness tests were conducted using 3PB specimens of different thicknesses. Fracture toughness values and R-curves are obtained, and the thickness effect is discussed. Using scanning electron microscopy (SEM), dimple fracture surfaces are observed precisely. It is found that the thickness effect appears clearly in the void growth process. Finite element (FEM) analyses are conducted based on these experimental data. Using Gurson’s constitutive equation, the nucleation and growth of voids during the dimple fracture process are simulated. The distribution patterns of stress triaxiality and the crack growth process are obtained. The results show a good agreement with experimental ones qualitatively. The effects of specimen thickness on R-curves are explained well on the basis of these numerical simulations.","PeriodicalId":170519,"journal":{"name":"Jsme International Journal Series A-solid Mechanics and Material Engineering","volume":"146 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-07-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Jsme International Journal Series A-solid Mechanics and Material Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1299/JSMEA.49.411","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

The thickness effect of a three-point-bend (3PB) specimen on dimple fracture behavior is studied experimentally and numerically. At first, fracture toughness tests were conducted using 3PB specimens of different thicknesses. Fracture toughness values and R-curves are obtained, and the thickness effect is discussed. Using scanning electron microscopy (SEM), dimple fracture surfaces are observed precisely. It is found that the thickness effect appears clearly in the void growth process. Finite element (FEM) analyses are conducted based on these experimental data. Using Gurson’s constitutive equation, the nucleation and growth of voids during the dimple fracture process are simulated. The distribution patterns of stress triaxiality and the crack growth process are obtained. The results show a good agreement with experimental ones qualitatively. The effects of specimen thickness on R-curves are explained well on the basis of these numerical simulations.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
三点弯曲试件的厚度效应研究
研究了三点弯曲(3PB)试样厚度对韧窝断裂行为的影响。首先,采用不同厚度的3PB试样进行断裂韧性试验。得到了断裂韧性值和r曲线,并讨论了厚度效应。利用扫描电子显微镜(SEM)对韧窝断口表面进行了精确观察。结果表明,在孔洞生长过程中,厚度效应明显。基于这些实验数据进行了有限元分析。利用Gurson本构方程,模拟了韧窝断裂过程中空洞的形核和扩展。得到了应力三轴性分布规律和裂纹扩展过程。定性分析结果与实验结果吻合较好。在此基础上,较好地解释了试样厚度对r曲线的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Evaluation of Initiation of the Interfacial Debonding in Single Fiber Composite Two Back Stress Hardening Models in Rate Independent Rigid Plastic Deformation Two Collinear Interface Cracks between Two Dissimilar Functionally Graded Piezoelectric/Piezomagnetic Material Layers under Anti-Plane Shear Loading Investigation the Dynamic Interaction between Two Collinear Cracks in the Functionally Graded Piezoelectric Materials Subjected to the Harmonic Anti-Plane Shear Stress Waves by Using the Non-Local Theory Development of a Finite Element Contact Analysis Algorithm to Pass the Patch Test
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1