Effect of Quadruple Size Transistor on SRAM Physically Unclonable Function Stabilized by Hot Carrier Injection

Shufan Xu, Kunyang Liu, Yichen Tang, Ruilin Zhang, H. Shinohara
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引用次数: 1

Abstract

This article presents a bitcell of a static randomaccess memory (SRAM)-based physically unclonable function (PUF) with quadruple-size transistor, which reduces the tail’ of mismatch distribution after hot carrier injection (HCI) burn-in. A statistical mismatch distribution model after HCI application for a certain time is proposed by combining native mismatch distribution before HCI and mismatch shift distribution after HCI. Model calculation shows that quadruple-size transistor SRAM PUF needs 15-min HCI burn-in time to achieve cryptographic level requirement, which is more than 3 times shorter than normal-size transistor SRAM PUF of 46-min. The effect of utilizing the quadruple-size transistor with respect to HCI burn-in for stability reinforcement is also confirmed by measuring chips fabricated in a 130-nm CMOS process. Experimental results show that the ‘tail’ in mismatch distribution is significantly eliminated after 18-min HCI burnin time of quadruple-size transistor SRAM PUF, which meets our expectations. The presented statistical model also matches the measurement data well.
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四倍尺寸晶体管对热载流子注入稳定SRAM物理不可克隆功能的影响
本文提出了一种基于静态随机存取存储器(SRAM)的四倍尺寸晶体管物理不可克隆函数(PUF)的位单元,它减少了热载流子注入(HCI)烧毁后失配分布的尾部。结合HCI前的本地错配分布和HCI后的错配移位分布,提出了HCI应用一定时间后的统计错配分布模型。模型计算表明,四倍尺寸晶体管SRAM PUF需要15分钟的HCI burn-in时间才能达到密码级要求,比正常尺寸晶体管SRAM PUF(46分钟)缩短了3倍以上。利用四倍尺寸晶体管在HCI老化方面的稳定性增强效果也通过测量130纳米CMOS工艺制造的芯片得到证实。实验结果表明,四倍尺寸晶体管SRAM PUF在HCI燃烧时间为18 min后,失配分布中的“尾巴”被显著消除,符合我们的预期。该统计模型与实测数据吻合良好。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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