Predicting printability of WSPs through rheological characterization

B. Carpenter, K. Pearsall, R. Raines
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引用次数: 5

Abstract

Water soluble fluxes and pastes contain a high percentage of free acids that increase the activation level and subsequently enhance solderability, but do not contain resins. A method was developed that can be used to predict the printability of a water soluble solder paste. Since a solder paste shear thins and exhibits a yield point during actual printing (paste flow) these two parameters were measured and then correlated to the resultant paste print performance on more than 40 different lots of paste. The measurement techniques used for the in-depth rheological characterization as well as the viscometers employed are discussed in detail.<>
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通过流变特性预测wsp的可印刷性
水溶性助焊剂和浆料含有高比例的游离酸,可提高活化水平并随后提高可焊性,但不含树脂。提出了一种可用于预测水溶性锡膏可印刷性的方法。由于锡膏剪切变薄并在实际印刷(膏体流动)过程中表现出屈服点,因此测量了这两个参数,然后将其与在40多个不同批次的膏体上产生的膏体印刷性能相关联。详细讨论了用于深入流变学表征的测量技术以及所使用的粘度计
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