{"title":"A Large Format Modified TEA CO/sub 2/ Laser Based Process for Cost Effective Small Via Generation","authors":"J. Morrison, T. Tessier, B. Gu","doi":"10.1109/ICMCM.1994.753577","DOIUrl":null,"url":null,"abstract":"Recently, a Transverse Excited Atmospheric (TEA) CO/sub 2/ laser technology has been developed-for the micro-machining of Was in non-reinforced glass laminates. This system has been designed to accommodate the large panel sizes associated with PW8 processing. The salient features of this modified CO/sub 2/ laser technology are summarized. A joint Lumonics / Motorola study was carried out to assess the applicability of this laser processing technology for use in higher density PWB and MCM-L substrate processing and its compatibility with currently available classes of dielectrics currently used in high density interconnect applications. A lox improvement in cycle time / throughput over our existing raster scanning laser ablation process has been demonstrated.","PeriodicalId":363745,"journal":{"name":"Proceedings of the International Conference on Multichip Modules","volume":"34 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-04-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of the International Conference on Multichip Modules","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICMCM.1994.753577","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Recently, a Transverse Excited Atmospheric (TEA) CO/sub 2/ laser technology has been developed-for the micro-machining of Was in non-reinforced glass laminates. This system has been designed to accommodate the large panel sizes associated with PW8 processing. The salient features of this modified CO/sub 2/ laser technology are summarized. A joint Lumonics / Motorola study was carried out to assess the applicability of this laser processing technology for use in higher density PWB and MCM-L substrate processing and its compatibility with currently available classes of dielectrics currently used in high density interconnect applications. A lox improvement in cycle time / throughput over our existing raster scanning laser ablation process has been demonstrated.
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