{"title":"Performance comparison between air-gap based coaxial TSV and conventional circular TSV in 3D-ICs","authors":"K. Salah","doi":"10.1109/IDT.2013.6727102","DOIUrl":null,"url":null,"abstract":"In this paper, performance comparison between Air-Gap Based Coaxial TSV and conventional circular TSV are presented. The comparison shows that the air-gap TSVs reduce the overall parasitic capacitance and the overall energy loss compared to the conventional circular TSV or conventional coaxial TSV.","PeriodicalId":446826,"journal":{"name":"2013 8th IEEE Design and Test Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 8th IEEE Design and Test Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IDT.2013.6727102","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper, performance comparison between Air-Gap Based Coaxial TSV and conventional circular TSV are presented. The comparison shows that the air-gap TSVs reduce the overall parasitic capacitance and the overall energy loss compared to the conventional circular TSV or conventional coaxial TSV.
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