{"title":"Reliability Analysis of Lead-free Flip Chip Solder Joint","authors":"Dong Wang, Xiaosong Ma, Dan Guo","doi":"10.1109/ICEPT.2007.4441538","DOIUrl":null,"url":null,"abstract":"The purpose of this paper is to study effect of thermal cycle condition on the reliability of lead-free flip chip solder joint. Flip chip assembly was subjected to thermal cycle (MIT-STD-883) condition. Two dimensional finite element analysis (FEA) has been carried out using ANSYS commercial software. There are two types of lead-free solder (Sn96.5-Ag3.5 and Sn95.5-Ag3.8-Cu0.7). They used flip chip solder joints have been evaluated. For each lead-free flip chip solder joint, thermal stress and strain have been studied. The plastic strain is mainly effect on thermal fatigue of solder joint, so two types of lead-free solder joint compare with Sn63-Pb37 solder joint in equivalent plastic strain, and thermal fatigue life of these three types of solder joint has been analyzed and assessed.","PeriodicalId":325619,"journal":{"name":"2007 8th International Conference on Electronic Packaging Technology","volume":"31 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 8th International Conference on Electronic Packaging Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2007.4441538","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The purpose of this paper is to study effect of thermal cycle condition on the reliability of lead-free flip chip solder joint. Flip chip assembly was subjected to thermal cycle (MIT-STD-883) condition. Two dimensional finite element analysis (FEA) has been carried out using ANSYS commercial software. There are two types of lead-free solder (Sn96.5-Ag3.5 and Sn95.5-Ag3.8-Cu0.7). They used flip chip solder joints have been evaluated. For each lead-free flip chip solder joint, thermal stress and strain have been studied. The plastic strain is mainly effect on thermal fatigue of solder joint, so two types of lead-free solder joint compare with Sn63-Pb37 solder joint in equivalent plastic strain, and thermal fatigue life of these three types of solder joint has been analyzed and assessed.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
