{"title":"Design of a high complexity superscalar microprocessor with the portable IDPS ASIC library","authors":"A. Greiner, L. Lucas, F. Wajsbürt, L. Winckel","doi":"10.1109/EDTC.1994.326906","DOIUrl":null,"url":null,"abstract":"This paper presents the design flow for a superscalar VLIW microprocessor using the 0.8 /spl mu/ CMOS portable ASIC library developed in the framework of the ESPRIT2 IDPS project. A full set of cell libraries and macro-block generators have been used, in order to achieve fast design cycle and to maintain a high level of integration and performance. The final circuit contains about 875000 transistors with a die size of 14.6/spl times/14.6 mm/sup 2/. The chip design and verification have been performed with new advanced CAD tools developed in the IDPS project. The layout uses a symbolic approach in order to provide process independence. The package is a 428-pin PGA.<<ETX>>","PeriodicalId":244297,"journal":{"name":"Proceedings of European Design and Test Conference EDAC-ETC-EUROASIC","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-02-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"13","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings of European Design and Test Conference EDAC-ETC-EUROASIC","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EDTC.1994.326906","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 13
Abstract
This paper presents the design flow for a superscalar VLIW microprocessor using the 0.8 /spl mu/ CMOS portable ASIC library developed in the framework of the ESPRIT2 IDPS project. A full set of cell libraries and macro-block generators have been used, in order to achieve fast design cycle and to maintain a high level of integration and performance. The final circuit contains about 875000 transistors with a die size of 14.6/spl times/14.6 mm/sup 2/. The chip design and verification have been performed with new advanced CAD tools developed in the IDPS project. The layout uses a symbolic approach in order to provide process independence. The package is a 428-pin PGA.<>