Environmental management in semiconductor and printed circuit board industry in India - part II: benchmarking and international best practice sharing

K. Schischke, U.C. Pandey, V.C. Sethi, H. Griese, H. Reichl
{"title":"Environmental management in semiconductor and printed circuit board industry in India - part II: benchmarking and international best practice sharing","authors":"K. Schischke, U.C. Pandey, V.C. Sethi, H. Griese, H. Reichl","doi":"10.1109/AGEC.2004.1290890","DOIUrl":null,"url":null,"abstract":"Part II of the paper on \"environmental management in semiconductor and printed circuit board industry in India\" sets the focus on benchmarking of the survey results and international best practice sharing. Environmental issues have got different priorities in different regions of the world. Also the general framework for the economy, open-mindedness for an appropriate environmental management and the approaches necessary to tackle environmental problems are specific for different regions. The part II paper compares the different background of Europe and India for implementing environmental management. The intermediary results of the DIT project are set in a global context through a benchmark analysis based on research and development activities of Fraunhofer IZM with European electronics industry. The importance of international know-how exchange to learn from each others' technological and environmental expertise is shown.","PeriodicalId":291057,"journal":{"name":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","volume":"5 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 International IEEE Conference on the Asian Green Electronics (AGEC). Proceedings of","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/AGEC.2004.1290890","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

Part II of the paper on "environmental management in semiconductor and printed circuit board industry in India" sets the focus on benchmarking of the survey results and international best practice sharing. Environmental issues have got different priorities in different regions of the world. Also the general framework for the economy, open-mindedness for an appropriate environmental management and the approaches necessary to tackle environmental problems are specific for different regions. The part II paper compares the different background of Europe and India for implementing environmental management. The intermediary results of the DIT project are set in a global context through a benchmark analysis based on research and development activities of Fraunhofer IZM with European electronics industry. The importance of international know-how exchange to learn from each others' technological and environmental expertise is shown.
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印度半导体和印刷电路板行业的环境管理-第二部分:基准制定和国际最佳实践分享
论文的第二部分“印度半导体和印刷电路板行业的环境管理”将重点放在调查结果的基准测试和国际最佳实践分享上。环境问题在世界不同地区有不同的优先级。此外,经济的总体框架、对适当环境管理的开放态度和处理环境问题的必要办法都是不同区域的具体情况。第二部分比较了欧洲和印度实施环境管理的不同背景。通过基于Fraunhofer IZM与欧洲电子工业的研发活动的基准分析,DIT项目的中间结果是在全球背景下设定的。国际知识交流对相互学习对方的技术和环境专门知识的重要性得到了体现。
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