Di Chen, Dacheng Zhang, G. Ding, Xiaolin Zhao, Jilin Zhang, Cunsheng Yang, B. Cai
{"title":"DEM technique: a new three-dimensional microfabrication technique for nonsilicon materials","authors":"Di Chen, Dacheng Zhang, G. Ding, Xiaolin Zhao, Jilin Zhang, Cunsheng Yang, B. Cai","doi":"10.1117/12.341181","DOIUrl":null,"url":null,"abstract":"DEM technique developed by present authors is a new 3D micro fabrication technique for non-silicon materials such as metals, plastics and ceramics. In comparison with LIGA technique, it does not need expensive synchrotron radiation source and x-ray masks. DEM technique has both advantages of bulk silicon micro fabrication technique and LIGA technique. In the present research, we obtained metallic mold insert with structure depth of 180 micrometers and aspect ratio more than 20. A successful development of DEm technique opens a new way for 3D micro fabrication of non-silicon materials.","PeriodicalId":318748,"journal":{"name":"Design, Test, Integration, and Packaging of MEMS/MOEMS","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-03-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Design, Test, Integration, and Packaging of MEMS/MOEMS","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1117/12.341181","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
DEM technique developed by present authors is a new 3D micro fabrication technique for non-silicon materials such as metals, plastics and ceramics. In comparison with LIGA technique, it does not need expensive synchrotron radiation source and x-ray masks. DEM technique has both advantages of bulk silicon micro fabrication technique and LIGA technique. In the present research, we obtained metallic mold insert with structure depth of 180 micrometers and aspect ratio more than 20. A successful development of DEm technique opens a new way for 3D micro fabrication of non-silicon materials.