ISTFA 2021 Highlights

{"title":"ISTFA 2021 Highlights","authors":"","doi":"10.31399/asm.edfa.2022-1.p033","DOIUrl":null,"url":null,"abstract":"\n The 47th International Symposium for Testing and Failure Analysis (ISTFA 2021) was held in Phoenix, Ariz., from October 31 to November 4, 2011. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User Group meetings, and the Women in Electronics Failure Analysis (WEFA) event.","PeriodicalId":431761,"journal":{"name":"EDFA Technical Articles","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"EDFA Technical Articles","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.31399/asm.edfa.2022-1.p033","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The 47th International Symposium for Testing and Failure Analysis (ISTFA 2021) was held in Phoenix, Ariz., from October 31 to November 4, 2011. This article provides a summary of the keynote presentation, technical program, panel discussion, tutorials, User Group meetings, and the Women in Electronics Failure Analysis (WEFA) event.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
ISTFA 2021亮点
第47届测试与失效分析国际研讨会(ISTFA 2021)在亚利桑那州凤凰城举行。,从2011年10月31日至11月4日。本文提供了主题演讲、技术计划、小组讨论、教程、用户组会议和女性电子故障分析(WEFA)活动的摘要。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Processes for Thinning and Polishing Highly Warped Die to a Nearly Consistent Thickness: Part III Four-Dimensional Scanning Transmission Electron Microscopy: Part II, Crystal Orientation and Phase, Short and Medium Range Order, and Electromagnetic Fields The Electronics Resurgence Initiative 2.0 for U.S. Semiconductor Manufacturing Advanced Characterization of Materials Using Atom Probe Tomography Laser-Based Copper Deposition for Semiconductor Debug Applications
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1