{"title":"Over-40-Gb/s IC module technology using 8-mm-square leadless chip carrier packages mounted on four-layer resin printed circuit boards","authors":"H. Sugahara, S. Kimura, K. Murata, E. Sano","doi":"10.1109/GAAS.2001.964389","DOIUrl":null,"url":null,"abstract":"A key technology for realizing small, low-cost IC modules for over-40-Gb/s optical communication systems has been developed. The technology mainly features 8-mm-square leadless chip carrier (LCC) packages and four-layer resin printed circuit boards (PCBs). It was applied to build a prototype multichip 1:4 DEMUX module operating at 45 Gb/s.","PeriodicalId":269944,"journal":{"name":"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"GaAs IC Symposium. IEEE Gallium Arsenide Integrated Circuit Symposium. 23rd Annual Technical Digest 2001 (Cat. No.01CH37191)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/GAAS.2001.964389","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
A key technology for realizing small, low-cost IC modules for over-40-Gb/s optical communication systems has been developed. The technology mainly features 8-mm-square leadless chip carrier (LCC) packages and four-layer resin printed circuit boards (PCBs). It was applied to build a prototype multichip 1:4 DEMUX module operating at 45 Gb/s.
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