High temperature-low temperature coefficient analog voltage reference integrated circuit implemented with SiC MESFETs

V. Banu, P. Godignon, M. Alexandru, M. Vellvehí, X. Jordà, J. Millán
{"title":"High temperature-low temperature coefficient analog voltage reference integrated circuit implemented with SiC MESFETs","authors":"V. Banu, P. Godignon, M. Alexandru, M. Vellvehí, X. Jordà, J. Millán","doi":"10.1109/ESSCIRC.2013.6649164","DOIUrl":null,"url":null,"abstract":"A high temperature compensated voltage reference integrated circuit (IC), was designed and for the first time fabricated on silicon carbide (SiC) material, using MESFET devices. A planar finger type MESFET was developed for this purpose. The schematic and the principle of the presented circuit is based on a new concept that replace the typical bandgap reference and avoid the necessity of using an operational amplifier (OpAmp), which is not yet developed on SiC. The experimental temperature coefficient (TC) is significantly better than a Zener diode and comparable to the normal bandgap voltage references on silicon, but the present circuit is able to work up to 300°C. The circuit contains also a linearized temperature sensor.","PeriodicalId":183620,"journal":{"name":"2013 Proceedings of the ESSCIRC (ESSCIRC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"11","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 Proceedings of the ESSCIRC (ESSCIRC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESSCIRC.2013.6649164","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 11

Abstract

A high temperature compensated voltage reference integrated circuit (IC), was designed and for the first time fabricated on silicon carbide (SiC) material, using MESFET devices. A planar finger type MESFET was developed for this purpose. The schematic and the principle of the presented circuit is based on a new concept that replace the typical bandgap reference and avoid the necessity of using an operational amplifier (OpAmp), which is not yet developed on SiC. The experimental temperature coefficient (TC) is significantly better than a Zener diode and comparable to the normal bandgap voltage references on silicon, but the present circuit is able to work up to 300°C. The circuit contains also a linearized temperature sensor.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
用SiC mesfet实现高温-低温系数模拟电压参考集成电路
采用MESFET器件,设计并首次在碳化硅(SiC)材料上制作了一种高温补偿电压参考集成电路(IC)。为此研制了一种平面指型MESFET。该电路的原理图和原理基于一种新的概念,取代了典型的带隙基准,避免了使用尚未在SiC上开发的运算放大器(OpAmp)的必要性。实验温度系数(TC)明显优于齐纳二极管,可与硅上的普通带隙电压参考相媲美,但目前的电路能够工作到300°C。该电路还包含一个线性化的温度传感器。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A 180nm fully-integrated dual-channel reconfigurable receiver for GNSS interoperations A 40 nm LP CMOS self-biased continuous-time comparator with sub-100ps delay at 1.1V & 1.2mW MEMS for automotive and consumer electronics A resistor-based temperature sensor for MEMS frequency references A 13.2% locking-range divide-by-6, 3.1mW, ILFD using even-harmonic-enhanced direct injection technique for millimeter-wave PLLs
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1