Investigation of the EBIC/TCM-method and application to VLSI-structures

A. Dallmann, D. Bollmann, G. Menzel
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引用次数: 3

Abstract

The EBIC/TCM (electron beam induced current/tunneling current microscopy) method was applied to gate oxide structures. Oxide defects could be localized exactly for further analyses by scanning or transmission electron microscopy. Passivated structures and trench capacitors were investigated. Semiautomatic measurements were carried out in order to obtain statistical results. In the case of degraded gate oxide before destructive breakdown, TCM was used. The best results were achieved in the depletion range. A lateral solution of about 200 nm and a step-resolution of 2 nm were attained. To avoid further radiation damage by the electron beam, laser-activated TCM was used. Both methods yielded comparable results.<>
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EBIC/ tcm方法的研究及其在vlsi结构中的应用
应用EBIC/TCM(电子束感应电流/隧道电流显微镜)方法研究栅极氧化物结构。氧化物缺陷可以通过扫描或透射电子显微镜精确定位,以便进一步分析。对钝化结构和沟槽电容器进行了研究。为了获得统计结果,进行了半自动测量。在破坏性击穿前降解栅极氧化物的情况下,使用TCM。在损耗范围内取得了最好的效果。获得了约200 nm的横向溶液和2 nm的阶跃分辨率。为了避免电子束进一步的辐射损伤,采用激光活化中药。两种方法得出的结果相当。
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