Hoang Anh Du Nguyen, Lei Xie, Jintao Yu, M. Taouil, S. Hamdioui
{"title":"Interconnect networks for resistive computing architectures","authors":"Hoang Anh Du Nguyen, Lei Xie, Jintao Yu, M. Taouil, S. Hamdioui","doi":"10.1109/DTIS.2017.7929872","DOIUrl":null,"url":null,"abstract":"Today's computing systems suffer from a memory/communication bottleneck, resulting in high energy consumption and saturated performance. This makes them inefficient in solving data-intensive applications at reasonable cost. Computation-In-Memory (CIM) architecture, based on the integration of storage and computation in the same physical location using non-volatile memristor crossbar technology, offers a potential solution to the memory bottleneck. An efficient interconnect network is essential to maximize CIM's architectural performance. This paper presents three interconnect network schemes for CIM architecture; these are (1) CMOS-based, (2) memristor-based and (3) hybrid cmos/memristor interconnect network scheme. To illustrate the feasibility of such schemes, a CIM parallel adder is used as a case study. The results show that the hybrid interconnect network scheme achieves a higher performance in comparison with the CMOS-based and memristor-based interconnect scheme in terms of delay, energy and area.","PeriodicalId":328905,"journal":{"name":"2017 12th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-04-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 12th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DTIS.2017.7929872","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Today's computing systems suffer from a memory/communication bottleneck, resulting in high energy consumption and saturated performance. This makes them inefficient in solving data-intensive applications at reasonable cost. Computation-In-Memory (CIM) architecture, based on the integration of storage and computation in the same physical location using non-volatile memristor crossbar technology, offers a potential solution to the memory bottleneck. An efficient interconnect network is essential to maximize CIM's architectural performance. This paper presents three interconnect network schemes for CIM architecture; these are (1) CMOS-based, (2) memristor-based and (3) hybrid cmos/memristor interconnect network scheme. To illustrate the feasibility of such schemes, a CIM parallel adder is used as a case study. The results show that the hybrid interconnect network scheme achieves a higher performance in comparison with the CMOS-based and memristor-based interconnect scheme in terms of delay, energy and area.