Latchup in CMOS technology

M. Hargrove, S. Voldman, R. Gauthier, J. Brown, K. Duncan, W. Craig
{"title":"Latchup in CMOS technology","authors":"M. Hargrove, S. Voldman, R. Gauthier, J. Brown, K. Duncan, W. Craig","doi":"10.1109/RELPHY.1998.670561","DOIUrl":null,"url":null,"abstract":"This paper is a review of the latchup phenomena in past and present CMOS technologies. Both static and transient characterization techniques are described, as well as process related solutions and layout ground rule constraints. Technology scaling implications are discussed in the context of latchup holding voltage/current and minimum N/sup +/ to P/sup +/ spacing.","PeriodicalId":196556,"journal":{"name":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","volume":"45 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"62","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RELPHY.1998.670561","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 62

Abstract

This paper is a review of the latchup phenomena in past and present CMOS technologies. Both static and transient characterization techniques are described, as well as process related solutions and layout ground rule constraints. Technology scaling implications are discussed in the context of latchup holding voltage/current and minimum N/sup +/ to P/sup +/ spacing.
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锁定在CMOS技术
本文综述了过去和现在CMOS技术中的锁存现象。描述了静态和瞬态表征技术,以及与工艺相关的解决方案和布局基本规则约束。在闭锁保持电压/电流和最小N/sup +/到P/sup +/间距的背景下,讨论了技术缩放的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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