High speed 15 ns 4 Mbit SRAM for space application

B. Coloma, P. Delaunay, O. Husson
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Abstract

A high speed 15 ns 4 Mbit asynchronous SRAM, 500 /spl mu/A stand-by current, 300 krad total dose tolerant, has been developed for space applications, using a hardened 0.25 micron 4 layers metal full CMOS process. A hierarchical organisation per IO bits has been used to achieve high speed as well as low dynamic consumption, also suited for simple SEU (single event upset) induced error corrections, allowing mitigation with classical EDAC corrector. The product operates within 3 to 3.6 V, and ambient temperature from -55 to +125/spl deg/C. A high density die size of 68.3 mm/sup 2/ allows the use of a specific 36-pins dual in line flat pack package with a 500 mil width, making this product very competitive against SEU hardened chips. Successful silicon results are presented as well as radiation tests up to 300 krad.
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高速15ns 4 Mbit SRAM用于空间应用
高速15 ns 4 Mbit异步SRAM, 500 /spl mu/A待机电流,300 krad总耐受剂量,已开发用于空间应用,采用硬化0.25微米4层金属全CMOS工艺。每个IO位的分层组织已被用于实现高速和低动态消耗,也适用于简单的SEU(单事件干扰)引起的错误纠正,允许使用经典的EDAC校正器进行缓解。产品工作电压范围为3 ~ 3.6 V,环境温度范围为-55 ~ +125/spl℃。高密度芯片尺寸为68.3 mm/sup 2/,允许使用特定的36针双线平面封装,宽度为500密耳,使该产品与SEU硬化芯片相比非常具有竞争力。介绍了硅的成功结果以及高达300克拉的辐射测试。
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