Study on the Influence of Different Filler Fractions on the Properties of Thermal Interface Materials

Abstract

Thermal interface material (TIM) has attracted numerous attentions to provide excellent performance and reliability of chip. To achieve outstanding thermal conductivity, high loading thermally conductive fillers have to be added in TIM, which weak the material's processability and mechanical properties. In this work, we fabricated a novel aluminum/zinc oxide/silicone composite. We studied the viscosity, mechanical and thermal properties of TIM with different filler content, and tried to discuss the relationship between them. When the content is 70%, the tensile properties of the material is up to the maximum value 420%. This work reveals the relationship between thermally conductive fillers and the macro-mechanical properties, and provides theoretical guidance for the preparation and application of high-performance TIM.