The new generation of power semiconductor devices

G. Amaratunga, F. Udea
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引用次数: 1

Abstract

The next generation of power devices are likely to extend MOS controlled bipolar (MCB) device concepts to cover very high voltage (up to 6 kV) applications. Such devices will be based on utilising the advantages brought about by trench gate MOSFETs to control bipolar current flow. The semiconductor phenomena which can be accessed to optimise power device performance through use of trench gate MOS channels are discussed. Device structures which use PIN diode and thyristor type carrier distributions to reduce power loss within the device are presented. The next generation of power switching devices is proposed as being based on trench gate devices which have hybrid PIN diode and dynamic thyristor structures.
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新一代功率半导体器件
下一代功率器件可能会扩展MOS控制双极(MCB)器件概念,以覆盖非常高的电压(高达6 kV)应用。这种器件将基于利用壕栅mosfet带来的优势来控制双极电流。讨论了利用沟槽栅MOS通道来优化功率器件性能的半导体现象。提出了利用PIN二极管和晶闸管型载流子分布来降低器件内功率损耗的器件结构。提出了基于混合PIN二极管和动态晶闸管结构的沟槽栅器件的新一代功率开关器件。
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