D. S. Yu, A. Chin, B. Hung, W. Chen, C.X. Zhu, M. Li, S. Y. Zhu, D. Kwong
{"title":"Low workfunction fully silicided gate on SiO/sub 2//Si and LaAlO/sub 3//GOI n-MOSFETs","authors":"D. S. Yu, A. Chin, B. Hung, W. Chen, C.X. Zhu, M. Li, S. Y. Zhu, D. Kwong","doi":"10.1109/DRC.2004.1367763","DOIUrl":null,"url":null,"abstract":"The main challenges for metal-gate/high-k CMOS are to find dual workfunction gates and robust high-k dielectrics. The low workfunction metal-gate for n-MOS is especially difficult since it reacts with oxygen rapidly and is hard to form a silicide or nitride. We have successfully developed 4.2 and 4.3 eV low workfunction NiSi:Hf and NiTiSi gates that were integrated onto SiO/sub 2//Si, novel high-k LaAlO/sub 3//Si and LaAlO/sub 3//GOI n-MOSFETs. The Hf or TiSi is for low workfunction control and the NiSi is for low resistivity.","PeriodicalId":385948,"journal":{"name":"Conference Digest [Includes 'Late News Papers' volume] Device Research Conference, 2004. 62nd DRC.","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Conference Digest [Includes 'Late News Papers' volume] Device Research Conference, 2004. 62nd DRC.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DRC.2004.1367763","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The main challenges for metal-gate/high-k CMOS are to find dual workfunction gates and robust high-k dielectrics. The low workfunction metal-gate for n-MOS is especially difficult since it reacts with oxygen rapidly and is hard to form a silicide or nitride. We have successfully developed 4.2 and 4.3 eV low workfunction NiSi:Hf and NiTiSi gates that were integrated onto SiO/sub 2//Si, novel high-k LaAlO/sub 3//Si and LaAlO/sub 3//GOI n-MOSFETs. The Hf or TiSi is for low workfunction control and the NiSi is for low resistivity.