R. Maeda, J. Chu, A. Schroth, J. Akedo, M. Ichiki, Z. Wang, S. Yonekubo
{"title":"Deposition And Patterning Technique For Realization Of PZT Thick Film Micro Actuator","authors":"R. Maeda, J. Chu, A. Schroth, J. Akedo, M. Ichiki, Z. Wang, S. Yonekubo","doi":"10.1109/IMNC.1998.730068","DOIUrl":null,"url":null,"abstract":"Introduction: Deposition technology of thin PZT layer has reached an advanced state in the application area of memory fabrication. On the other hand, the application of PZT layer for actuation of micro electromechanical system (MEMS) is not well established. Relatively thicker film is necessary in this application. Conventional preparation techniques provide poor deposition rates and the accumulated residual stress during deposition results in peal off of the deposited layered structure. Another difficulty lies in the low etching rate of the multilayered structure of Si02/Ti/Pt/PZT/Ti/Pt.","PeriodicalId":356908,"journal":{"name":"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1998-07-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Papers. Microprocesses and Nanotechnology'98. 198 International Microprocesses and Nanotechnology Conference (Cat. No.98EX135)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMNC.1998.730068","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Introduction: Deposition technology of thin PZT layer has reached an advanced state in the application area of memory fabrication. On the other hand, the application of PZT layer for actuation of micro electromechanical system (MEMS) is not well established. Relatively thicker film is necessary in this application. Conventional preparation techniques provide poor deposition rates and the accumulated residual stress during deposition results in peal off of the deposited layered structure. Another difficulty lies in the low etching rate of the multilayered structure of Si02/Ti/Pt/PZT/Ti/Pt.