1200x84-pixels 30fps 64cc Solid-State LiDAR RX with an HV/LV transistors Hybrid Active-Quenching-SPAD Array and Background Digital PT Compensation

Toshiki Sugimoto, T. Ta, K. Kokubun, Satoshi Kondo, T. Itakura, Hisaaki Katagiri, Yutaka Ota, M. Sengoku, H. Kwon, K. Sasaki, H. Kubota, Kazuhiro Suzuki, K. Kimura, A. Sai
{"title":"1200x84-pixels 30fps 64cc Solid-State LiDAR RX with an HV/LV transistors Hybrid Active-Quenching-SPAD Array and Background Digital PT Compensation","authors":"Toshiki Sugimoto, T. Ta, K. Kokubun, Satoshi Kondo, T. Itakura, Hisaaki Katagiri, Yutaka Ota, M. Sengoku, H. Kwon, K. Sasaki, H. Kubota, Kazuhiro Suzuki, K. Kimura, A. Sai","doi":"10.1109/vlsitechnologyandcir46769.2022.9830414","DOIUrl":null,"url":null,"abstract":"This paper presents two essential techniques, Active-Quenching (AQ) -SPAD consisting of hybrid HV/LV transistors and Digital SPAD Characteristic Compensation (DSCC) circuit to realize high-performance and palm-size LiDAR. The hybrid AQ circuit shrinks a pixel area while ensures a high PDE. The high pixel density 2D-SPAD array realizes high image-resolution palm-size LiDAR by reducing light-receiving lens and RX unit size. The DSCC provides an on-chip Process/Temperature (PT) calibration without external components, which contributes to weatherability assurance and LiDAR miniaturization. These technologies downsize LiDAR RX to the world’s smallest size, 64cc, and realize a total 350cc-size LiDAR with the competitive performance as a mechanical one.","PeriodicalId":332454,"journal":{"name":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-06-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/vlsitechnologyandcir46769.2022.9830414","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

This paper presents two essential techniques, Active-Quenching (AQ) -SPAD consisting of hybrid HV/LV transistors and Digital SPAD Characteristic Compensation (DSCC) circuit to realize high-performance and palm-size LiDAR. The hybrid AQ circuit shrinks a pixel area while ensures a high PDE. The high pixel density 2D-SPAD array realizes high image-resolution palm-size LiDAR by reducing light-receiving lens and RX unit size. The DSCC provides an on-chip Process/Temperature (PT) calibration without external components, which contributes to weatherability assurance and LiDAR miniaturization. These technologies downsize LiDAR RX to the world’s smallest size, 64cc, and realize a total 350cc-size LiDAR with the competitive performance as a mechanical one.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
1200x84像素30fps 64cc固态激光雷达RX与高压/低压晶体管混合有源淬火- spad阵列和背景数字PT补偿
本文提出了两种实现高性能手掌大小激光雷达的关键技术,即由高压/低压混合晶体管组成的有源猝灭(AQ) -SPAD和数字SPAD特性补偿(DSCC)电路。混合AQ电路缩小了像素面积,同时确保了高PDE。高像素密度2D-SPAD阵列通过减小接收光透镜和RX单元尺寸,实现了手掌大小的高图像分辨率激光雷达。DSCC提供片上工艺/温度(PT)校准,无需外部组件,这有助于保证耐候性和激光雷达小型化。这些技术将激光雷达RX的尺寸缩小到世界上最小的64cc,实现了350cc大小的激光雷达,其性能与机械雷达一样具有竞争力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A 12-bit 8GS/s RF Sampling DAC with Code-Dependent Nonlinearity Compensation and Intersegmental Current-Mismatch Calibration in 5nm FinFET Scalable 1.4 μW cryo-CMOS SP4T multiplexer operating at 10 mK for high-fidelity superconducting qubit measurements A 507 GMACs/J 256-Core Domain Adaptive Systolic-Array-Processor for Wireless Communication and Linear-Algebra Kernels in 12nm FINFET An 81.6dB SNDR 15.625MHz BW 3rd Order CT SDM with a True TI NS Quantizer Energy-Efficient High Bandwidth 6T SRAM Design on Intel 4 CMOS Technology
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1