{"title":"Predicting time-to-failure using finite element analysis","authors":"G. A. Bivens","doi":"10.1109/ARMS.1990.67976","DOIUrl":null,"url":null,"abstract":"Finite element analysis (FEA) was performed on three different surface mounted designs: a leadless chip carrier, gull-wing chip carrier, and compliant S-lead leadless chip carrier. The output of the FEA was input into the Coffin-Manson model, and the number of thermal cycles to failure was estimated. The results indicated that the gull-wing and S-leads chip carriers would be reliable when placed in this temperature environment but the leadless chip carriers would have reliability problems after a short period of time.<<ETX>>","PeriodicalId":383597,"journal":{"name":"Annual Proceedings on Reliability and Maintainability Symposium","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-01-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Annual Proceedings on Reliability and Maintainability Symposium","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ARMS.1990.67976","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Finite element analysis (FEA) was performed on three different surface mounted designs: a leadless chip carrier, gull-wing chip carrier, and compliant S-lead leadless chip carrier. The output of the FEA was input into the Coffin-Manson model, and the number of thermal cycles to failure was estimated. The results indicated that the gull-wing and S-leads chip carriers would be reliable when placed in this temperature environment but the leadless chip carriers would have reliability problems after a short period of time.<>
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