Three-dimensional emerging nonvolatile memory for the high-density and neuromorphic applications

W. Banerjee, Ming Liu
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Abstract

Resistive random access memory (RRAM) is one of the most promising emerging nonvolatile memory candidates for the future application as high-density memory and also for neuromorphic computing. Here, we show the fabrication of three-dimensional (3D) emerging RRAM devices based on the TiOx/Al2O3 bilayer design. The devices are showing good resistive switching performances after going through the initial forming process. All devices of the 3D stack are able to execute symmetrical switching behavior. Moreover, the devices are showing continuous synaptic characteristics based on the pulse dependent measurements. All of the observed phenomena are showing the possibility of using the TiOx/Al2O3 bilayer RRAM devices for the high-density and neuromorphic applications.
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用于高密度和神经形态应用的三维新兴非易失性存储器
电阻式随机存取存储器(RRAM)是未来高密度存储器和神经形态计算中最有前途的非易失性存储器之一。在这里,我们展示了基于TiOx/Al2O3双层设计的三维(3D)新兴RRAM器件的制造。经过初始成形后,器件表现出良好的电阻开关性能。三维堆叠的所有器件都能够执行对称开关行为。此外,该装置显示出基于脉冲相关测量的连续突触特征。所有观察到的现象都显示了将TiOx/Al2O3双层RRAM器件用于高密度和神经形态应用的可能性。
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