P. Beckett, A. R. Fleming, R. J. Foster, J. M. Gilbert, A. V. Polijanczuk, D. G. Whitehead
{"title":"An automated pick-place laser soldering process for electronics assembly","authors":"P. Beckett, A. R. Fleming, R. J. Foster, J. M. Gilbert, A. V. Polijanczuk, D. G. Whitehead","doi":"10.1109/ECTC.1994.367496","DOIUrl":null,"url":null,"abstract":"The trend to high pin-count high density packaging in surface mount assembly has highlighted inherent difficulties in the automatic placement and soldering of these very fine pitch devices. The integration of a laser soldering operation with the placement process can provide one solution to the problem, particularly where the attachment of large high-value devices is involved. This paper will describe the use of a solid state laser diode power source as part of an automatic pick-place-solder technique which, by allowing a secondary assembly process for specific devices, avoids the environmental extremes introduced by conventional soldering.<<ETX>>","PeriodicalId":344532,"journal":{"name":"1994 Proceedings. 44th Electronic Components and Technology Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1994-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1994 Proceedings. 44th Electronic Components and Technology Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.1994.367496","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
The trend to high pin-count high density packaging in surface mount assembly has highlighted inherent difficulties in the automatic placement and soldering of these very fine pitch devices. The integration of a laser soldering operation with the placement process can provide one solution to the problem, particularly where the attachment of large high-value devices is involved. This paper will describe the use of a solid state laser diode power source as part of an automatic pick-place-solder technique which, by allowing a secondary assembly process for specific devices, avoids the environmental extremes introduced by conventional soldering.<>
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