“Zero” drain-current drift of inversion-mode NMOSFET on InP (111)A surface

Chen Wang, Min Xu, R. Colby, E. Stach, P. Ye
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引用次数: 3

Abstract

InP is a commonly used compound semiconductor with wide applications in electronic, optoelectronic, and photonic devices. Compared to GaAs, InP is widely believed to be a more forgiving material with respect to Fermi level pinning and has a higher electron saturation velocity (2.5×107 cm/s) as well. It could be a viable channel material for high-speed logic applications if a high-quality, thermodynamically stable high-k dielectric could be found. [1] It is of great importance for the understanding of high-k/InP interfaces since InP is identified as a transition layer for ALD high-k/InGaAs quantum well transistor in state-of-the-art devices. [2] Motivated by previous work on surface orientation studies of GaAs [3] and InGaAs [4], we have systematically studied NMOSFETs, MOSCAPs, and interfacial chemistry on two different crystalline surfaces: InP (100) and (111)A (In-rich). With ALD Al2O3 in direct contact as gate dielectric, a record high drain current of 600 µA/µm is obtained for an InP inversion-mode MOSFET on the (111)A surface with a gate length of 1µm, which is a factor of 2.6 enhancement compared to the (100) surface at the same VG-VT condition. The smoother Al2O3/(111)A interface and a shift of the charge-neutrality-level (CNL) [5] on InP(111)A toward the conduction band edge is identified as the origin of this drain current enhancement in spite of the extracted interface trap density (Dit). [6] In this paper, we report on “zero” drain-current drift on InP (111)A MOSFETs which is a major issue to prevent commercializing InP MOSFET technology on (100) surface in 1980s. [7]
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InP (111)A表面上NMOSFET的“零”漏极电流漂移
InP是一种常用的化合物半导体,在电子、光电和光子器件中有着广泛的应用。与砷化镓相比,InP被广泛认为是一种更宽容的材料,相对于费米水平钉钉,并且具有更高的电子饱和速度(2.5×107 cm/s)。如果能找到一种高质量的、热力学稳定的高k介电介质,它可能成为高速逻辑应用的可行通道材料。[1]这对于理解高k/InP接口具有重要意义,因为在最先进的器件中,InP被认为是ALD高k/InGaAs量子阱晶体管的过渡层。[2]受前人对GaAs[3]和InGaAs[4]的表面取向研究的启发,我们系统地研究了两种不同晶体表面:InP(100)和(111)A (In-rich)上的nmosfet、MOSCAPs和界面化学。当ALD Al2O3作为栅极电介质直接接触时,在栅极长度为1 μ m的(111)a表面上的InP反相MOSFET获得了600 μ a / μ m的高漏极电流,与相同VG-VT条件下的(100)表面相比,这是2.6倍。尽管提取了界面陷阱密度(Dit),但更光滑的Al2O3/(111)A界面和InP(111)A上向导带边缘移动的电荷中性电平(CNL)[5]被确定为漏极电流增强的来源。[6]在本文中,我们报道了InP (111)A MOSFET上的“零”漏极电流漂移,这是20世纪80年代阻碍(100)表面InP MOSFET技术商业化的主要问题。[7]
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