Optical components and their role in optical networks

M. Lebby
{"title":"Optical components and their role in optical networks","authors":"M. Lebby","doi":"10.1109/ECTC.2001.927765","DOIUrl":null,"url":null,"abstract":"With the recent frenzy of new start-ups and acquisition activity in the optical communications space, companies are positioning themselves to better provide customers with the solutions they need for higher bandwidth and performance in the network. Coupled with staggering valuations, the expectations set by the financial institutions puts heavy pressure on creativity in commercializing optoelectronic solutions. Clearly, for high performance and efficient networks, the industry needs to be enabled by new optoelectronic component technologies and new system architectures. This paper reviews and roadmaps some of the key optoelectronic component and module based technologies that will be needed to support customer expectations over the next decade. The paper has two themes: firstly, optical technologies and what they can offer in terms of performance and bandwidth, and secondly, a view on technology roadmaps and where optical technologies are heading. Binding the two themes together will be a critical view of optoelectronic integrated circuits (OEICs). OEICs are well documented in the R&D establishment with over 15 years of papers, however, are gradually emerging as commercial products in optical networking architectures. This paper will review progress made and what the industry can expect from the integration of optical components for better performance metrics as the industry moves forward. The key metrics will include the silicon effect on manufacturing planar components such as optical multipliers (also known as mux and demux), both with add/drop capabilities as well as other associated planar components such as variable optical attenuators, switches, amplifiers etc. As in the majority of OEIC designs, different IC functions with emitter (laser) and receiver (detector) solutions will be discussed.","PeriodicalId":340217,"journal":{"name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2001.927765","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

With the recent frenzy of new start-ups and acquisition activity in the optical communications space, companies are positioning themselves to better provide customers with the solutions they need for higher bandwidth and performance in the network. Coupled with staggering valuations, the expectations set by the financial institutions puts heavy pressure on creativity in commercializing optoelectronic solutions. Clearly, for high performance and efficient networks, the industry needs to be enabled by new optoelectronic component technologies and new system architectures. This paper reviews and roadmaps some of the key optoelectronic component and module based technologies that will be needed to support customer expectations over the next decade. The paper has two themes: firstly, optical technologies and what they can offer in terms of performance and bandwidth, and secondly, a view on technology roadmaps and where optical technologies are heading. Binding the two themes together will be a critical view of optoelectronic integrated circuits (OEICs). OEICs are well documented in the R&D establishment with over 15 years of papers, however, are gradually emerging as commercial products in optical networking architectures. This paper will review progress made and what the industry can expect from the integration of optical components for better performance metrics as the industry moves forward. The key metrics will include the silicon effect on manufacturing planar components such as optical multipliers (also known as mux and demux), both with add/drop capabilities as well as other associated planar components such as variable optical attenuators, switches, amplifiers etc. As in the majority of OEIC designs, different IC functions with emitter (laser) and receiver (detector) solutions will be discussed.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
光器件及其在光网络中的作用
随着最近光通信领域新成立的公司和收购活动的狂热,公司正在为自己定位,以便更好地为客户提供他们需要的更高带宽和性能的网络解决方案。再加上惊人的估值,金融机构设定的期望给光电解决方案商业化的创造力带来了沉重的压力。显然,为了实现高性能和高效的网络,该行业需要新的光电元件技术和新的系统架构。本文回顾和规划了一些关键的光电元件和模块技术,这些技术将需要在未来十年支持客户的期望。本文有两个主题:首先,光学技术及其在性能和带宽方面可以提供什么,其次,对技术路线图和光学技术的发展方向的看法。将这两个主题结合在一起将是光电集成电路(OEICs)的关键观点。oeic在研发机构中有超过15年的文献记录,然而,它正逐渐成为光网络架构中的商业产品。本文将回顾所取得的进展,以及随着行业的发展,该行业可以从光学元件集成中获得更好的性能指标。关键指标将包括制造平面元件的硅效应,如光乘法器(也称为mux和demux),两者都具有添加/下降功能,以及其他相关的平面元件,如可变光衰减器、开关、放大器等。与大多数OEIC设计一样,将讨论发射器(激光器)和接收器(探测器)解决方案的不同IC功能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
A quasi three-dimensional distributed electromagnetic model for complex power distribution networks Thermal fatigue properties of lead-free solders on Cu and NiP under bump metallurgies Microlens arrays with integrated thin film power monitors Intermetallic reactions between lead-free SnAgCu solder and Ni(P)/Au surface finish on PWBs Nondestructive detection of intermetallics in solder joints by high energy X-ray diffraction
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1