Yuto Kubota, I. Shohji, T. Tsuchida, Kiyotomo Nakamura
{"title":"Tensile properties of low-melting point Sn-Bi-Sb solder","authors":"Yuto Kubota, I. Shohji, T. Tsuchida, Kiyotomo Nakamura","doi":"10.1109/EPTC.2014.7028319","DOIUrl":null,"url":null,"abstract":"Tensile properties of Sn-57.5Bi-0.5Sb (mass%) lead-free solder were investigated with miniature size specimens and the results were compared to those of Sn-58Bi (mass%) and Sn-3.0Ag-0.5Cu (mass%). At 25°C, tensile properties of Sn-57.5Bi-0.5Sb are similar to those of Sn-58Bi. At high temperatures, tensile strength and 0.1% proof stress of Sn-57.5Bi-0.5Sb becomes to be lower than those of Sn-58Bi and Sn-3.0Ag-0.5Cu. On the other hand, elongation of Sn-57.5Bi-0.5Sb is somewhat superior to that of Sn-58Bi and much higher than that of Sn-3.0Ag-0.5Cu at high temperatures. Characteristic change of them can be explained by the refinement of micro structure due to the addition of a small amount of Sb to Sn-Bi solder.","PeriodicalId":115713,"journal":{"name":"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 IEEE 16th Electronics Packaging Technology Conference (EPTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPTC.2014.7028319","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
Tensile properties of Sn-57.5Bi-0.5Sb (mass%) lead-free solder were investigated with miniature size specimens and the results were compared to those of Sn-58Bi (mass%) and Sn-3.0Ag-0.5Cu (mass%). At 25°C, tensile properties of Sn-57.5Bi-0.5Sb are similar to those of Sn-58Bi. At high temperatures, tensile strength and 0.1% proof stress of Sn-57.5Bi-0.5Sb becomes to be lower than those of Sn-58Bi and Sn-3.0Ag-0.5Cu. On the other hand, elongation of Sn-57.5Bi-0.5Sb is somewhat superior to that of Sn-58Bi and much higher than that of Sn-3.0Ag-0.5Cu at high temperatures. Characteristic change of them can be explained by the refinement of micro structure due to the addition of a small amount of Sb to Sn-Bi solder.
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