Characterization and reduction of simultaneous switching noise for a multilayer package

1994 Proceedings. 44th Electronic Components and Technology Conference Pub Date : 1994-05-01 DOI:10.1109/ECTC.1994.367514

N. Hirano, M. Miura, Y. Hiruta, Toshio Sudo

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引用次数: 29

Abstract

This paper reports a test chip and an experimental method for characterizing the simultaneous switching noise (SSN) and the noise dependency on the ground pin assignment of a multilayer package. The SSN measurement was executed for various ground pin assignments. The measured results demonstrated that an extra electric current path of the displaced ground pin assignment enhanced the ground bounce due to increasing the effective inductance of package. A balanced pin assignment of the ground pins which suppressed the extra current path in the ground plane had a 20% reduction effect for SSN compared with conventional pin assignments. The extra current path of the ground plane was also verified by an electromagnetic field simulation. The modeling procedure was established for the noise estimation using the inductance value estimated by the field simulation. The circuit simulation resulted in a good agreement with the measured results, and the noise simulation method was applicable for the noise estimation at earlier stage of the package design.<>

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多层封装同步开关噪声的表征与降低

本文报道了一种测试芯片和实验方法，用于表征多层封装的同时开关噪声(SSN)和噪声对地引脚分配的依赖关系。SSN测量是针对各种地引脚分配执行的。测量结果表明，由于增加了封装的有效电感，位移接地引脚分配的额外电流路径增强了接地反弹。与传统引脚分配相比，接地引脚的平衡引脚分配抑制了接平面中的额外电流路径，对SSN有20%的降低效果。电磁场仿真也验证了该接地平面的额外电流路径。建立了利用现场仿真估计的电感值进行噪声估计的建模程序。电路仿真结果与实测结果吻合较好，噪声仿真方法适用于封装设计前期的噪声估计。

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1994 Proceedings. 44th Electronic Components and Technology Conference

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